A Semi-Quantitative Method for Thin Film Adhesion Measurement

Abstract

Film deposition techniques are used in several applications. In tribo/ogy, wear and friction can be changed significantly by depositing a thin film on the contacting surfaces. A vital factor for this application is the adhesion between the film and the substrate. Due to high contact stresses in many tribological applications, high adhesion is required. Measurement of adhesion is therefore important if coated elements are to be used with confidence. A method has been developed for the measurement of adhesion which uses a composite model. This method is presented in this paper. A one-dimensional elastic analysis is sufficient to determine adhesion strength. In this method an interfacial shear stress is generated at the film-tosubstrate interface by imposing a strain difference between the film and substrate. This interfacial shear stress is used to evaluate film adhesion. If the film-substrate adhesion is less than the shear stress applied to the interface the film will debond; otherwise, it will remain adhered to the substrate. The analysis developed yields a quantitative expression for the interfacial shear strength. Therefore the adhesion can be quantitatively determined. 472/Vol. 107, OCTOBER 1985 Transactions of the ASME Copyright © 1985 by ASME Downloaded From: http://tribology.asmedigitalcollection.asme.org/ on 06/11/2015 Terms of Use: http://asme.org/terms 2 ^i(«.)

Evaluation on Interface Bonding of Thin Aluminum Clad Steel Strip

“…Therefore, it is most important to evaluate the bond strength of thin Al clad steel strip after brazing. There are several methods used for quantifying the bond strength of layered materials, such as tension test [8], shear test [9,10,11] and peeling test [12]. However, different methods imply different stress states, which may affect the determination of critical reduction during cold roll bonding.…”