A Selective Etching Solution for Use with Patterned Self-Assembled Monolayers of Alkanethiolates on Gold

Xia, Younan; Zhao, Xiaomei; Kim, Enoch; Whitesides, George M.

doi:10.1021/cm00060a023

Cited by 227 publications

(228 citation statements)

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“…CP (13,17) on the Au͞Ti produces m-scale circuit patterns on the PDMS. The rubber stamp in this case has features of relief in the geometry of the source͞drain level (i.e., source͞drain electrodes and appropriate interconnects) of the circuit.…”

Section: Methodsmentioning

confidence: 99%

See 1 more Smart Citation

Soft, conformable electrical contacts for organic semiconductors: High-resolution plastic circuits by lamination

Loo¹,

Someya²,

Baldwin³

et al. 2002

Proc. Natl. Acad. Sci. U.S.A.

209

129

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Soft, conformable electrical contacts provide efficient, noninvasive probes for the transport properties of chemically and mechanically fragile, ultrathin organic semiconducting films. When combined with high-resolution printing and lamination techniques, these soft contacts also form the basis of a powerful technique for fabricating flexible plastic circuits. In this approach, a thin elastomeric film on a plastic substrate supports the electrodes and interconnections; laminating this substrate against another plastic substrate that supports the gate, dielectric and semiconductor levels establishes effective electrical contacts and completes the circuits. In addition to eliminating many of the problems associated with traditional layer-by-layer fabrication strategies, this lamination scheme possesses other attractive features: the transistors and circuit elements are naturally and efficiently encapsulated, and the active organic semiconductor layer is placed near the neutral mechanical plane. We demonstrate the features of soft, laminated contacts by fabricating large arrays of high-performance thin film transistors on plastic substrates by using a wide variety of organic semiconductors.

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Section: Methodsmentioning

confidence: 99%

“…However, our experience indicates that CP generally works better on PDMS than it does on the types of relatively hard substrates (e.g., plastic, glass silicon, etc.) that have been used in the past (13,17). This finding is likely caused by the conformability of the PDMS substrate, thus facilitating an even better contact with the stamp.…”

Section: Methodsmentioning

confidence: 99%

Soft, conformable electrical contacts for organic semiconductors: High-resolution plastic circuits by lamination

Loo¹,

Someya²,

Baldwin³

et al. 2002

Proc. Natl. Acad. Sci. U.S.A.

209

129

View full text Add to dashboard Cite

show abstract

“…Another gold etchant which has been proposed is the thiosulfate system formulated from K 2 S 2 O 3 and KOH and using K 3 Fe(CN) 6 as an oxidant [57]. These etchants are usually operated in the alkaline region as thiosulfate ions as unstable at pH<10 [3].…”

Section: Aqueous Etchantsmentioning

confidence: 99%

Gold etching for microfabrication

2014

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The etching of gold is a key enabling technology in the fabrication of many microdevices and is widely used in the electronic, optoelectronic and microelectromechanical systems (MEMS) industries. In this review, we examine some of the available methods for patterning gold thin films using dry and wet etching techniques. Dry methods which utilise reactive ion etching (RIE) have a number of important advantages over other methods, but the low volatility of gold etch products has made the development of suitable processes problematic. More recently, the adoption of high-density plasma reactors with optimised chlorine-based chemistries has allowed improved processes to be developed, and etching in hydrogen plasmas also shows promise. Wet etching methods for gold have also been critically reviewed. Traditionally, iodine-and cyanide-based etch processes have been used, but in the last decade, a number of alternative etchants have been studied. Of particular interest is the recent development of a range of novel nonaqueous-based gold etchants, and the suitability of these etchants for microfabrication is assessed.

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“…The substrates were immersed in a ferri͞ferrocyanide etching bath (22) [1 mM K 4 Fe(CN) 6 , 10 mM K 3 Fe(CN) 6 , 0.1 M Na 2 S 2 O 3 , 1.0 M KOH] shortly (Ͻ2 h) after they were printed. The etching proceeded, at room temperature and without agitation, for Ϸ12 min.…”

Section: Figmentioning

confidence: 99%

Paper-like electronic displays: Large-area rubber-stamped plastic sheets of electronics and microencapsulated electrophoretic inks

Rogers¹,

Bao²,

Baldwin³

et al. 2001

Proc. Natl. Acad. Sci. U.S.A.

1,105

674

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Electronic systems that use rugged lightweight plastics potentially offer attractive characteristics (low-cost processing, mechanical flexibility, large area coverage, etc.) that are not easily achieved with established silicon technologies. This paper summarizes work that demonstrates many of these characteristics in a realistic system: organic active matrix backplane circuits (256 transistors) for large (Ϸ5 ؋ 5-inch) mechanically flexible sheets of electronic paper, an emerging type of display. The success of this effort relies on new or improved processing techniques and materials for plastic electronics, including methods for (i) rubber stamping (microcontact printing) high-resolution (Ϸ1 m) circuits with low levels of defects and good registration over large areas, (ii) achieving low leakage with thin dielectrics deposited onto surfaces with relief, (iii) constructing highperformance organic transistors with bottom contact geometries, (iv) encapsulating these transistors, (v) depositing, in a repeatable way, organic semiconductors with uniform electrical characteristics over large areas, and (vi) low-temperature (Ϸ100°C) annealing to increase the on͞off ratios of the transistors and to improve the uniformity of their characteristics. The sophistication and flexibility of the patterning procedures, high level of integration on plastic substrates, large area coverage, and good performance of the transistors are all important features of this work. We successfully integrate these circuits with microencapsulated electrophoretic ''inks'' to form sheets of electronic paper.T he backplane circuit consists of a square array of 256 suitably interconnected p-channel transistors. Fig. 1 shows the circuit layout. Fig. 2 presents a cross-sectional illustration of a transistor and a top view of a unit cell. The completed display (total thickness Ϸ1 mm) comprises a transparent frontplane electrode of indium tin oxide (ITO) and a thin unpatterned layer of flexible electronic ''ink'' mounted against a sheet that supports square pixel electrode pads and pinouts; these pixel pads attach, via a conductive adhesive, to the back planes. Each transistor functions as a switch that locally controls the color of the ink, which consists of a layer of polymeric microcapsules filled with a suspension of charged pigments in a colored fluid (1, 2). In each of the four quadrants of the display, transistors in a given column have connected gates, and those in a given row have connected source electrodes. Applying a voltage to a column (gate) and a row (source) electrode turns on the transistor located at the cell where these electrodes intersect. Activating the transistor generates an electric field between the frontplane ITO and the corresponding pixel electrode. This field causes movement of a pigment within the microcapsules, which changes the color of the pixel, as observed through the ITO: when the pigments flow to the ITO side of the capsules, the color of the pigment (white in this case) determines the color of the pixel; when they ...

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A Selective Etching Solution for Use with Patterned Self-Assembled Monolayers of Alkanethiolates on Gold

Cited by 227 publications

References 0 publications

Soft, conformable electrical contacts for organic semiconductors: High-resolution plastic circuits by lamination

Soft, conformable electrical contacts for organic semiconductors: High-resolution plastic circuits by lamination

Gold etching for microfabrication

Paper-like electronic displays: Large-area rubber-stamped plastic sheets of electronics and microencapsulated electrophoretic inks

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