2007 IEEE International Symposium on Electromagnetic Compatibility 2007
DOI: 10.1109/isemc.2007.84
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A Scalable Model of Board to FPC Interconnect Using Neural Networks

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Cited by 2 publications
(2 citation statements)
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“…Considering a constant increase of integration densities, having a possibility of performing fast and accurate system-level simulations in an early design stage and optimizing its performance is of increasing importance. Connectors are typically modeled by multisegment lumpedelements as in [1], [3]- [7] or multisegment transmission lines as in [8]- [10]. In all of these papers, the model parameters are fitted to the measured data, either the S-parameter measurements as in [3], the time-domain reflectometry (TDR) as in [4], [6]- [9], or both as in [1] and [5].…”
Section: Introductionmentioning
confidence: 99%
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“…Considering a constant increase of integration densities, having a possibility of performing fast and accurate system-level simulations in an early design stage and optimizing its performance is of increasing importance. Connectors are typically modeled by multisegment lumpedelements as in [1], [3]- [7] or multisegment transmission lines as in [8]- [10]. In all of these papers, the model parameters are fitted to the measured data, either the S-parameter measurements as in [3], the time-domain reflectometry (TDR) as in [4], [6]- [9], or both as in [1] and [5].…”
Section: Introductionmentioning
confidence: 99%
“…In all of these papers, the model parameters are fitted to the measured data, either the S-parameter measurements as in [3], the time-domain reflectometry (TDR) as in [4], [6]- [9], or both as in [1] and [5]. Alternatively, electromagnetic (EM) simulations can be used to generate the required data [10], [11]. Modeling based on the measurements and/or EM simulations is time-consuming.…”
Section: Introductionmentioning
confidence: 99%