A Review: Solder Joint Cracks at Sn-Bi58 Solder ACFs Joints

Abstract

In this chapter, solder joint cracks at Sn-Bi58 solder ACF joints were investigated in conventional thermal compression bonding and ultrasonic bonding. It was found that resin storage modulus is the crucial for solder joint morphology regardless of bonding pressures. At high temperature, polymer resin tends to rebound above Tg and break the molten solder morphology. We proposed two useful methods to keep off solder joints cracks during bonding process. One is to remain bonding pressure until room temperature, the other is to use fillers to increase resin thermal mechanical property. The thermal cycling reliability was significantly enhanced when solder joint morphology was modified using 10 wt% 0.2 μm SiO 2 fillers in acrylic based Sn-Bi58 solder ACF joints.