2018
DOI: 10.1016/j.infrared.2018.03.009
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A review on plasma-etch-process induced damage of HgCdTe

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Cited by 13 publications
(5 citation statements)
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“…The HgCdTe detector is actually a single pixel of a focal plane array and ready for flip-chip bonding. The meta-lens consisting of a nano-pillar array is proposed to be fabricated by hard-mask-assisted reactive ion etching [36][37][38][39][40][41] . The hard mask made of SiO 2 can enhance the etching selectivity by over 37 times 38 compared to a photoresist mask, and then enable the formation of high-aspect-ratio structures [39][40][41] .…”
Section: Device Structurementioning
confidence: 99%
“…The HgCdTe detector is actually a single pixel of a focal plane array and ready for flip-chip bonding. The meta-lens consisting of a nano-pillar array is proposed to be fabricated by hard-mask-assisted reactive ion etching [36][37][38][39][40][41] . The hard mask made of SiO 2 can enhance the etching selectivity by over 37 times 38 compared to a photoresist mask, and then enable the formation of high-aspect-ratio structures [39][40][41] .…”
Section: Device Structurementioning
confidence: 99%
“…11 A role-allocated graphene/ZnO heterostructure sensor has been reported to increase the NO 2 gas-sensing response to approximately 30 times higher than that of the graphene sensor. 12 In the past 20 years, low RF plasma and plasma facilities have been successfully used in various applications, such as the fabrication of PV device, 13 surface passivation and plasma etching, 14,15 wafer cleaning technology, 16 surface decontamination of medical devices, 17 sanitization of delicate, 18 heatsensitive surfaces in the electronics industry, and reduction of thermal degradation during food processing. 19,20 The RF plasma technology is also used to improve the gas-sensing performance.…”
Section: ■ Introductionmentioning
confidence: 99%
“…In the past 20 years, low RF plasma and plasma facilities have been successfully used in various applications, such as the fabrication of PV device, surface passivation and plasma etching, , wafer cleaning technology, surface decontamination of medical devices, sanitization of delicate, heat-sensitive surfaces in the electronics industry, and reduction of thermal degradation during food processing. , The RF plasma technology is also used to improve the gas-sensing performance. However, the treatment mechanism of plasma is less involved in current studies, and the improvement in sensing performance is uncertain, either surface etching or cleaning.…”
Section: Introductionmentioning
confidence: 99%
“…Several etching methods can be employed, namely (a) wet chemical etching, (b) pure physical ion-beam etching (IBE), and (c) a combination of chemical and physical reactive-ion plasma etching. While ion-beam etching and reactive-ion plasma etching enable precise control over the etch depth, they induce doping and crystal damage in the material [4][5][6]. On the contrary, wet chemical etching preserves the pristine quality of the crystal structure.…”
Section: Introductionmentioning
confidence: 99%