A review on modelling and numerical simulation of micro hot embossing process: fabrication, mold filling behavior, and demolding analysis

Abstract

Micro-hot embossing (micro-HE) of polymeric materials creates exact micro/nanoscaled designs. Micro-HE processes include plate-to-plate (P2P), roll-to-roll (R2R), and roll-to-plate (R2P). Micro-HE is preferred for large-scale production of micro-patterns on polymer substrates. However, the lack of simulation models for optimization and component design prevents the broad use of this technology. As the size of the micro patterns decreases from micron to sub-micron, it improves performance features. Micro-HE cannot be analyzed using software tools like injection molding since there is no macroscopic equivalent. Commercial simulation software covers injection molding and associated processes. No commercial tool covers all micro-HE process steps, variations, and boundary conditions. According to the authors, such review articles aren't in the literature. This article summarizes the simulation work in the micro-HE process field related to replication accuracy, and mold filling behaviour. In addition to this, various models were discussed based on properties of material, based on various forces participating in the HE process, and gives a detailed idea about mold-filling behavior and demolding analysis. Finally challenges and future scope related to modelling and simulation work in field of hot embossing has been presented.

Fabrication of Nanogroove Arrays on Acrylic Film Using Micro-Embossing Technique

“…As the temperature rises, the viscosity of an acrylic film decreases [ 52 ], which allows the melt of an acrylic film to flow faster into the master mold cavities. Therefore, the fluidity of a melted acrylic film must be enhanced by increasing the embossing temperature [ 53 ]. These results indicate that an acrylic film does not flow into the nanometer cavities at temperatures near Tg , and the optimum embossing temperature of this study appears to be at 60 °C above Tg .…”