2019
DOI: 10.1109/jestpe.2019.2925336
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A Review on Electrothermal Modeling of Supercapacitors for Energy Storage Applications

Abstract: Supercapacitors are drawing more and more attention in energy storage applications. This paper aims to discuss the state of the art of application-oriented electro-thermal modeling methods for supercapacitors and identify the limitations and future research opportunities. Electro-thermal modeling is essential to model-based design, thermal management, and reliability analysis of supercapacitors for energy storage applications. The review provides new perspectives with respect to existing surveys which focus ma… Show more

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Cited by 29 publications
(9 citation statements)
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“…In LiCs, the proportion of the reversible heat source is more extensive than the irreversible heat source due to Faradaic reactions, thus it cannot be neglected. In contrast, the proportion of reversible heat in EDLCs is significantly smaller than irreversible heat sources so that it can be neglected in the heat generation equations [ 125 ]. This would be the main difference between EDLCs and LiCs in terms of heat generation modeling.…”
Section: 1d Electrical Thermal and Lifetime Modelingmentioning
confidence: 99%
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“…In LiCs, the proportion of the reversible heat source is more extensive than the irreversible heat source due to Faradaic reactions, thus it cannot be neglected. In contrast, the proportion of reversible heat in EDLCs is significantly smaller than irreversible heat sources so that it can be neglected in the heat generation equations [ 125 ]. This would be the main difference between EDLCs and LiCs in terms of heat generation modeling.…”
Section: 1d Electrical Thermal and Lifetime Modelingmentioning
confidence: 99%
“… The RC branch used to predict the thermal behavior of LiC 3300 F cell that consists of four lateral sides (S 1 , S 2 , S 3 , and S 4 ) front and back sides [ 59 , 125 ]. …”
Section: Figurementioning
confidence: 99%
“…In order to analyze the thermal stress, according to the geometric dimensions, physical parameters and material properties of the actual capacitor banks, the multiple physical properties model is established by the finite element simulation, as shown in Fig. 6 [23] [24].…”
Section: B Multiple Physical Properties Modelingmentioning
confidence: 99%
“…Most of existing works mainly use the independent mathematical models to address the issue of the thermal stress of capacitor [11], [14], and [16]- [20], but the influence of the thermal capacity, thermal coupling, and potential air cooling are ignored. The material, geometric, and thermal properties of capacitor can be simulated in the multi-physics model [23]- [24].…”
Section: Introductionmentioning
confidence: 99%
“…Particularly, models of power semiconductor devices, to which GaN Schottky diodes belong, should take into account also thermal phenomena. Models taking into account these phenomena are called electrothermal models (Zarębski and Dąbrowski, 2011; Zarębski and Górecki, 2007; Górecki and Górecki, 2017; Mawby et al , 2001; Zarębski and Górecki, 2009; Janicki et al , 2014;Yang et al , 2019; Wei et al , 2019; Górecki and Detka, 2019; Górecki, 2015; Starzak et al , 2018; Jarndal, 2019; Górecki and Ptak, 2018; Zubert et al , 2012).…”
Section: Introductionmentioning
confidence: 99%