2022
DOI: 10.1016/j.applthermaleng.2022.118273
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A review on convective heat transfer enhancement using ultrasound

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Cited by 41 publications
(9 citation statements)
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“…There is intrinsic ambiguity involved in the creation of new knowledge. It expands our knowledge (Dehbani et al, 2022) According Okpara etal. ( 2016) believed in the open innovation concept, which is defined as using an invention to develop a commercial good or service.…”
Section: A: Collect Notes B-collecting and Process Data Linked To Mar...supporting
confidence: 68%
“…There is intrinsic ambiguity involved in the creation of new knowledge. It expands our knowledge (Dehbani et al, 2022) According Okpara etal. ( 2016) believed in the open innovation concept, which is defined as using an invention to develop a commercial good or service.…”
Section: A: Collect Notes B-collecting and Process Data Linked To Mar...supporting
confidence: 68%
“…The experiments are carried out at room temperature (23.5 °C) under the following operational conditions: mass flux ( G ) 118.64–218.04 kg/(m 2 ∙s), heat flux ( q ) 10.23–56.51 kW/m 2 , inlet temperature 35.3–36.5 °C, absolute saturation pressure of minichannel section 152 ± 1 kPa, ultrasonic field frequency 23 kHz, 28 kHz, 32 kHz and 40 kHz, and sound intensity ( I ) 12.5 W/cm 2 , 25 W/cm 2 , 37.5 W/cm 2 and 50 W/cm 2 . The selection for the range of ultrasonic frequencies (between 23 and 40 kHz) is due to that the acoustic flow effect and cavitation effect with enhanced heat transfer effect can be generated in low-frequency ultrasound (20 ∼ 100 kHz) [6] , [34] . First, inert gas ( N 2 ) is injected into the experimental system to clean the pipeline and check for any leaks.…”
Section: Methodsmentioning
confidence: 99%
“…Since the 1960s, researchers have been increasingly interested in ultrasound as a new and effective method of enhancing heat transfer [5] , [6] . Wong and Chon [7] conducted experiments to investigate the effects of ultrasonic vibrations on heat transfer by natural convection and boiling.…”
Section: Introductionmentioning
confidence: 99%
“…Common methods for cooling electronic devices include heat sinks, liquid cooling system, axial fans, and so on [ 1 , 2 , 3 , 4 ]. However, the high integration, miniaturization, and application situation diversity of electronic devices put forward higher requirements (such as small area heat dissipation, high penetrating capability, or low noise) for cooling system designs [ 5 , 6 , 7 ]. An effective cooling method for small heating elements can not only reduce the structural complexity of cooling systems, but also make cooling systems more energy-efficient.…”
Section: Introductionmentioning
confidence: 99%