A review on advanced carbon-based thermal interface materials for electronic devices

Khan, Jawad; Momin, Syed Abdul; Mariatti, M.

doi:10.1016/j.carbon.2020.06.012

Cited by 135 publications

(53 citation statements)

References 285 publications

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“…By contrast with the vertical graphene monoliths and horizontal graphene papers possessing high TC only along one-dimensional direction, the g-rGO/PI aerogel can maintain the 3D continuous thermal transport paths at the compacted status due the high compressibility of the aerogels, which leads to the aerogels possessing high TC values along both through-plane and in-plane directions. Good contact between mating surface and TIMs is also important for highly efficient heat transport at the interface [1][2][3]. Thus, the thermal contact resistance has been discussed.…”

Section: Resultsmentioning

confidence: 99%

“…The compression effectively decreases the porosity of the g-rGO/PI aerogel and leads to densification. Air as a bad conductor of heat (TC of ~ 0.22 W m −1 K −1 [ 1 ]) inside of rGO cells can be removed by the compression. The previous literatures also reported that the densification process could improve TC values of graphene-based TIMs remarkably [ 8 , 9 , 10 , 11 ].…”

Section: Resultsmentioning

confidence: 99%

“…Good contact between mating surface and TIMs is also important for highly efficient heat transport at the interface [ 1 , 2 , 3 ]. Thus, the thermal contact resistance has been discussed.…”

Section: Resultsmentioning

confidence: 99%

“…With the rapid development of portable devices and high-power electronics, severe heat dissipation issues greatly threaten the reliability and performance of the high-tech devices [ 1 , 2 , 3 ]. To decrease the thermal interface resistance between the heat producing component and the radiator, thermal interface materials (TIMs) are usually inserted between them to solve the interfacial heat transfer problem [ 4 , 5 ].…”

Section: Introductionmentioning

confidence: 99%

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Graphitized-rGO/Polyimide Aerogel as the Compressible Thermal Interface Material with Both High in-Plane and through-Plane Thermal Conductivities

Cheng

et al. 2021

Materials

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Reduced graphene oxide (rGO) aerogels with a three-dimensional (3D) interconnected network provides continuous heat transport paths in multi-directions. However, the high porosity of rGO aerogels commonly leads to very low thermal conductivity (TC), and defects and grain boundaries of rGO sheets result in a high extent of phonon scattering, which is far from satisfying the requirement of thermal interface materials (TIMs). Here, a compressible graphitized-rGO/polyimide (g-rGO/PI) aerogel was prepared by the ice-template method and “molecular welding” strategy. The regular cellular structure and closely packed cell walls bring the g-rGO/PI aerogel high compressibility, which made the aerogel can maintain the continuous thermal transport paths well even in highly compacted status. The rGO sheets in the cell wall surface are welded up by g-PI during imidization and graphitization treatment, providing efficient channels for phonon transportation in the 3D network. The g-rGO/PI aerogel in a compressive strain of 95% has a high TC in the plane of 172.5 W m−1k−1 and a high TC through the plane of 58.1 W m−1k−1, which is superior to other carbon-based TIMs previously reported.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

“…Good contact between mating surface and TIMs is also important for highly efficient heat transport at the interface [ 1 , 2 , 3 ]. Thus, the thermal contact resistance has been discussed.…”

Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Graphitized-rGO/Polyimide Aerogel as the Compressible Thermal Interface Material with Both High in-Plane and through-Plane Thermal Conductivities

Cheng

et al. 2021

Materials

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“…The growing packing density accelerates this process because of the increasing power density [ 2 ]. A report revealed that every 2 degrees increase in temperature would lead to a 10% degradation in the performance of electronic devices [ 3 ].Therefore, developing efficient heat-dissipating materials is a critical task for preserving reliability [ 4 ].…”

Section: Introductionmentioning

confidence: 99%

Achieving a 3D Thermally Conductive while Electrically Insulating Network in Polybenzoxazine with a Novel Hybrid Filler Composed of Boron Nitride and Carbon Nanotubes

Wang

Drummer

et al. 2020

Polymers

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To solve the problem of excessive heat accumulation in the electronic packaging field, a novel series of hybrid filler (BN@CNT) with a hierarchical “line-plane” structure was assembled via a condensation reaction between functional boron nitride(f-BN) and acid treated carbon nanotubes (a-CNTs). The reactions with different mass ratios of BN and CNTs and the effect of the obtained hybrid filler on the composites’ thermal conductivity were studied. According to the results, BN@15CNT exhibited better effects on promoting thermal conductivity of polybenzoxazine(PBz) composites which were prepared via ball milling and hot compression. The thermally conductive coefficient value of PBz composites, which were loaded with 25 wt% of BN@15CNT hybrid fillers, reached 0.794 W· m−1· K−1. The coefficient value was improved to 0.865 W· m−1· K−1 with 15 wt% of BN@15CNT and 10 wt% of BN. Although CNTs were adopted, the PBz composites maintained insulation. Dielectric properties and thermal stability of the composites were also studied. In addition, different thermal conduction models were used to manifest the mechanism of BN@CNT hybrid fillers in enhancing thermal conductivity of PBz composites.

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Electronic Packaging Materials for Thermal Management

Zhang,

Xiao

et al. 2023

Thermal Management Materials for Electronic Packaging

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A review on advanced carbon-based thermal interface materials for electronic devices

Cited by 135 publications

References 285 publications

Graphitized-rGO/Polyimide Aerogel as the Compressible Thermal Interface Material with Both High in-Plane and through-Plane Thermal Conductivities

Graphitized-rGO/Polyimide Aerogel as the Compressible Thermal Interface Material with Both High in-Plane and through-Plane Thermal Conductivities

Achieving a 3D Thermally Conductive while Electrically Insulating Network in Polybenzoxazine with a Novel Hybrid Filler Composed of Boron Nitride and Carbon Nanotubes

Electronic Packaging Materials for Thermal Management

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