2018
DOI: 10.1016/j.applthermaleng.2018.07.070
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A review of thermal performance in multiple evaporators loop heat pipe

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Cited by 44 publications
(6 citation statements)
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References 53 publications
(89 reference statements)
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“…Therefore, there was an urgent need for an advanced cooling device with excellent thermal conductivity to solve these problems mentioned above. Heat pipes, as common thermal management devices, were widely used in the field of electronic heat dissipation due to their simple structure and high reliability [ 7 , 8 , 9 , 10 , 11 , 12 ]. The heat pipe may be classified as a thermosyphon, conventional heat pipe, loop heat pipe (LHP), micro heat pipe, rotating heat pipe, vapor chamber, and oscillating heat pipe (OHP).…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, there was an urgent need for an advanced cooling device with excellent thermal conductivity to solve these problems mentioned above. Heat pipes, as common thermal management devices, were widely used in the field of electronic heat dissipation due to their simple structure and high reliability [ 7 , 8 , 9 , 10 , 11 , 12 ]. The heat pipe may be classified as a thermosyphon, conventional heat pipe, loop heat pipe (LHP), micro heat pipe, rotating heat pipe, vapor chamber, and oscillating heat pipe (OHP).…”
Section: Introductionmentioning
confidence: 99%
“…As a result, the use of passive cooling methods such heat pipes (at microscales) are made possible by the miniaturized cooling of these devices with strong heat flux dissipation of the order of 10 4 to 10 6 W/m 2 . The necessity for fundamental research in porous media heat transfer originates from the need for a better understanding of thermal engineering applications that uses porous materials such as the evaporator portion of the heat pipe where heat needs to be dissipated [4,5]. Porous media are distinguished from non-porous media by two fundamental characteristics: a large specific surface area and the tortuous morphology of capillaries.…”
Section: Introductionmentioning
confidence: 99%
“…Improving surface structures [1], which typically include grooves, fins, and porous surfaces of various shapes, is the main approach adopted for enhancing boiling heat transfer. The porous surface heat exchanger developed in the 1960s has had wide application prospects in the industry due to its high boiling efficiency, low-temperature difference boiling, high critical heat flux (CHF), and good anti-fouling capability [2].…”
Section: Introductionmentioning
confidence: 99%