A review of the thermal conductivity of graphite reinforced metal matrix composite materials

Ayers, G. H.; Fletcher, L. S.

doi:10.2514/6.1996-1830

Search citation statements

Order By: Relevance

Paper Sections

Select...

Introduction1

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2024

Publication Types

Select...

Other1

Relationship

Self Cite0

Independent1

Authors

Journals

Cited by 1 publication

(1 citation statement)

References 13 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Huang obtained graphite film/Cu/Al composite by hot isostatic pressing at 655 ℃/45 MPa/100 min. The thermal conductivity is 380 W/mK ~940 W/mK [4][5] .…”

Section: Introductionmentioning

confidence: 99%

Interface control and preparation technology of ultrahigh thermal conductivity APG/Cu composites

Liu,

Xie,

Guo

et al. 2024

Ninth International Conference on Energy Materials and Electrical Engineering (ICEMEE 2023)

View full text Add to dashboard Cite

With the increase in electronic devices' power density, the thermal runaway caused by thermal aggregation seriously affects the reliability and life of electronic devices. To diffuse the point heat source into the area heat source to reduce the heat aggregation phenomenon, a novel copper encapsulated annealed pyrolytic graphite (APG) was prepared by vacuum hot pressing (VHP). The influence of preparation and plating parameters on the microstructure and thermal conductivity of APG/Cu were studied. As a result, the uniform and compact Ti coating with 0.7 μm thickness was obtained by vacuum evaporation at 800 ℃ for 1.5 h. High thermal conductivity was obtained by the sintering process with graphite content of 50 vol.% at 870 ℃/50 MPa. An ultrahigh in-plane thermal conductivity of 1243.19 W/mK for APG/Cu composites with 50 vol.% graphite content was obtained at 870 ℃/50 MPa. Currently, the density of the composite exceeds 98%. Ultrahigh thermal conductivity makes APG/Cu composites a candidate material for thermal management.

show abstract

“…Huang obtained graphite film/Cu/Al composite by hot isostatic pressing at 655 ℃/45 MPa/100 min. The thermal conductivity is 380 W/mK ~940 W/mK [4][5] .…”

Section: Introductionmentioning

confidence: 99%