A Review of Solder Glasses

Frieser, R. G.

doi:10.1155/apec.2.163

Cited by 46 publications

(24 citation statements)

References 5 publications

(5 reference statements)

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“…The ratio of powder to solvent was determined empirically. The firing cycle was based on the manufacturer's recommendations, the literature (32,33), a differential scanning calorimetry analysis of the glass solder, and trial and error. The finished microreactor and tubes were sealed to the vacuum package shown in Fig.…”

Section: Methodsmentioning

confidence: 99%

Toward high-energy-density, high-efficiency, and moderate-temperature chip-scale thermophotovoltaics

Chan

Bermel

Pilawa-Podgurski

et al. 2013

Proc. Natl. Acad. Sci. U.S.A.

166

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The challenging problem of ultra-high-energy-density, high-efficiency, and small-scale portable power generation is addressed here using a distinctive thermophotovoltaic energy conversion mechanism and chip-based system design, which we name the microthermophotovoltaic (μTPV) generator. The approach is predicted to be capable of up to 32% efficient heat-to-electricity conversion within a millimeter-scale form factor. Although considerable technological barriers need to be overcome to reach full performance, we have performed a robust experimental demonstration that validates the theoretical framework and the key system components. Even with a much-simplified μTPV system design with theoretical efficiency prediction of 2.7%, we experimentally demonstrate 2.5% efficiency. The μTPV experimental system that was built and tested comprises a silicon propane microcombustor, an integrated high-temperature photonic crystal selective thermal emitter, four 0.55-eV GaInAsSb thermophotovoltaic diodes, and an ultrahigh-efficiency maximum power-point tracking power electronics converter. The system was demonstrated to operate up to 800°C (silicon microcombustor temperature) with an input thermal power of 13.7 W, generating 344 mW of electric power over a 1-cm 2 area.catalytic combustion | micro generator | thermal radiation W ith the recent proliferation of power-hungry mobile devices, significant research efforts have been focused on developing clean, quiet, and portable high-energy-density, compact power sources. Although batteries offer a well-known solution, limits on the chemistry developed to date constrain the energy density to ∼0.2 kWh/kg, whereas many hydrocarbon fuels have energy densities closer to 12 kWh/kg. The fundamental question is, How efficiently and robustly can these widely available chemical fuels be converted into electricity in a millimeter-scale system? Indeed, it is difficult to tap the full potential of hydrocarbon fuels on a small scale. However, their high energy density allows even relatively inefficient generators to be competitive with batteries. To this end, researchers have explored different energy conversion routes, such as mechanical heat engines (1), fuel cells (2, 3), thermoelectrics (4, 5), and thermophotovoltaics (TPVs) (6, 7).TPVs present an extremely appealing approach for small-scale power sources due to the combination of high power density limited ultimately by Planck blackbody emission, multifuel operation due to the ease of generating heat, and a fully static conversion process. Small-scale TPVs have yet to be demonstrated and are particularly challenging because of the need to develop strong synergistic interactions between chemical, thermal, optical, and electrical domains, which in turn give rise to requirements for extreme materials performance and subsystems synchronization.In this work, we present a proof of concept microthermovoltaic (μTPV) system, shown in Fig. 1, that validates the theoretical foundation and paves the way toward a new breed of ultra-highenergy-density, hi...

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Section: Methodsmentioning

confidence: 99%

Toward high-energy-density, high-efficiency, and moderate-temperature chip-scale thermophotovoltaics

Chan

Bermel

Pilawa-Podgurski

et al. 2013

Proc. Natl. Acad. Sci. U.S.A.

166

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“…One of these compositions was found to be very effective sintering aid for the basic varistor powder while maintaining its electrical properties within very useful level. This glass, consisted of 20 mol% ZnO, 40 mol% PbO and 40 mol% B 2 O 3 (labelled PZB), is typically used for radiation shielding and glass solder for sealing [13,14]. The glass was prepared by weighing the starting materials (Johnson Matthey Gmbh, Germany) and mixing them in distilled water for one hour in a ball-mill jar with agate balls.…”

Section: Methodsmentioning

confidence: 99%

Microstructural and electrical properties of multicomponent varistor ceramics with PbO–ZnO–B2O3 glass addition

et al. 2007

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Zinc oxide based ceramics are widely used materials in varistors because of their excellent nonlinearity. Traditionally these ceramics are sintered at high temperatures (about 1,100-1,300°C). In this work a novel zinc oxide-based material with a low sintering temperature (900-1,000°C) was investigated. This material can be used in varistors consisting of several ceramic layers with embedded silver/palladium thick-film electrodes. This paper explains the research procedure employed with this novel varistor material, including the effect of sintering aid addition on the final electrical properties and fired microstructure. The electrical properties achieved are compared to the values measured from the original zinc oxide composition without sintering aid addition. Especially the I-V characteristics, nonlinearity coefficient !, breakdown voltage V bk and leakage current density J L are investigated. The sintering properties are also reported. It was found that by adding 10 wt.% of glass and using a 900°C sintering temperature, the material had good varistor characteristics, as V bk =378 V/mm, !=33 and J L =15 μA/cm 2 . The investigated varistor material can be applied to protect electrical circuits against surges.

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“…(i) hermetic sealing of packages, lamps, electrical feedthroughs and semiconductor devices 13,14,16,17,19,44,45 (ii) hermetic sealing and mechanical attachment of sensors 23,27 ( Fig. 1) (iii) encapsulation of semiconductor devices 29,30 (iv) overglazing of automotive, packaging and architectural glass 33,34,[46][47][48] (v) photovoltaic (PV) solar cell technology -conductors and contacts 42,43,[49][50][51][52][53] (vi) enamelling of aluminium in architecture and home appliances 35,[54][55][56][57][58] (vii) thick film (TF) electronics and other devices 21,22,24,25,27,59 on various substrates: 60 glasses for TF resistor (TFR), 61,62 conductor, 63,64 overglaze, dielectric 65 and sealing [15][16][17][18][19] m...…”

Section: Introduction Low Melting Glasses In Electronics and Other Apmentioning

confidence: 99%

“…1) (iii) encapsulation of semiconductor devices 29,30 (iv) overglazing of automotive, packaging and architectural glass 33,34,[46][47][48] (v) photovoltaic (PV) solar cell technology -conductors and contacts 42,43,[49][50][51][52][53] (vi) enamelling of aluminium in architecture and home appliances 35,[54][55][56][57][58] (vii) thick film (TF) electronics and other devices 21,22,24,25,27,59 on various substrates: 60 glasses for TF resistor (TFR), 61,62 conductor, 63,64 overglaze, dielectric 65 and sealing [15][16][17][18][19] materials (Fig. 1, the section on 'PbO in low melting frits and TF technology'); especially, special low firing compositions for fabrication of circuits and sensors on glass or metals.…”

Section: Introduction Low Melting Glasses In Electronics and Other Apmentioning

confidence: 99%

Review of Bi₂O₃ based glasses for electronics and related applications

Maeder

2013

International Materials Reviews

148

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The present work critically reviews the scientific and patent literature on low melting bismuth based oxide glass frits in materials for electronics, sensors and related applications such as sealing glasses, solar cells, architectural and automotive glass, the main motivation being to replace lead based materials by environmentally more benign ones. Due to similar glass forming properties of Bi and Pb, Bi based glasses are the closest 'drop-in' alternative for lead bearing formulations, and are therefore actually replacing them in many applications, helped also by previous experience with Bi containing materials in thick film technology and component metallisations. The outstanding issues are discussed, e.g. matching the lowest processing temperatures achieved by the classical lead based glasses without sacrificing durability and stability, as well as stability versus chemical reduction. Finally, consideration is also given to special 'heavy' glasses (often containing Bi and Pb together) that are useful in fields such as optics, superconductors and nuclear technology, as well as to specific Bi 2 O 3 containing crystalline compounds.Keywords: Glasses, Bismuth, Bi 2 O 3 , Electronics, Optics, Thick film technology, Sensors Introduction Low melting glasses in electronics and other applicationsAs for ceramics, inorganic glasses, glass-ceramic and glaze materials have long gone beyond their traditional uses to address a wide array of modern technological challenges, Owing to performance and cost criteria, most standard glasses have relatively high softening points. However, there are many technological applications where a low softening temperature is required, in order to lower energy expenditure, avoid damaging devices in contact with the glass during processing or ensure compatibility with other materials:(i) hermetic sealing of packages, lamps, electrical feedthroughs and semiconductor devices 13,14,16,17,19,44,45 (ii) hermetic sealing and mechanical attachment of sensors 23,27 ( Fig. 1) (iii) encapsulation of semiconductor devices 29,30 (iv) overglazing of automotive, packaging and architectural glass 33,34,[46][47][48] (v) photovoltaic (PV) solar cell technology -conductors and contacts 42,43,[49][50][51][52][53] (vi) enamelling of aluminium in architecture and home appliances 35,[54][55][56][57][58] (vii) thick film (TF) electronics and other devices 21,22,24,25,27,59 (Fig. 1, the section on 'PbO in low melting frits and TF technology'); especially, special low firing compositions for fabrication of circuits and sensors on glass or metals. 1,28,[66][67][68][69][70][71][72] For these applications, glasses are often formulated as frits (e.g. finely divided powder), which may be applied, dispersed in a suitable medium, onto a substrate by various methods such as slip casting, screen printing, roller/curtain coating, spraying, dispensing and electrophoresis, or as preforms for sealing. Classically, the aforementioned applications have to a great extent used lead based glasses, which have a rather unique combinat...

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A Review of Solder Glasses

Abstract: A compilation of data on solder glasses from the literature is presented. Sources are: Chemical Abstracts, Ceramic Abstracts, Abstracts in Physics and Chemistry of Glasses, and pertinent books. Even though not exhaustive, domestic and foreign sources are included.

Cited by 46 publications

References 5 publications

Toward high-energy-density, high-efficiency, and moderate-temperature chip-scale thermophotovoltaics

Toward high-energy-density, high-efficiency, and moderate-temperature chip-scale thermophotovoltaics

Microstructural and electrical properties of multicomponent varistor ceramics with PbO–ZnO–B2O3 glass addition

Review of Bi₂O₃ based glasses for electronics and related applications

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A Review of Solder Glasses

Abstract: A compilation of data on solder glasses from the literature is presented. Sources are: Chemical Abstracts, Ceramic Abstracts, Abstracts in Physics and Chemistry of Glasses, and pertinent books. Even though not exhaustive, domestic and foreign sources are included.

Cited by 46 publications

References 5 publications

Toward high-energy-density, high-efficiency, and moderate-temperature chip-scale thermophotovoltaics

Toward high-energy-density, high-efficiency, and moderate-temperature chip-scale thermophotovoltaics

Microstructural and electrical properties of multicomponent varistor ceramics with PbO–ZnO–B2O3 glass addition

Review of Bi2O3 based glasses for electronics and related applications

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Product

Resources

About

Review of Bi₂O₃ based glasses for electronics and related applications