1984
DOI: 10.1016/0042-207x(84)90083-6
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A review of reactive ion beam etching for production

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Cited by 17 publications
(6 citation statements)
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“…The pattern transfer of the resist profile into the fused silica substrate was performed by RIBE. 34,35 An advantage of RIBE is the large range of selectivities (etch rate of substrate material related to etch rate of mask material) that can be realized by varying the mixture of the reactive gases. The selectivity can be varied over several orders of magnitude making it possible to compress or stretch surface profiles during the pattern transfer.…”
Section: Methodsmentioning
confidence: 99%
“…The pattern transfer of the resist profile into the fused silica substrate was performed by RIBE. 34,35 An advantage of RIBE is the large range of selectivities (etch rate of substrate material related to etch rate of mask material) that can be realized by varying the mixture of the reactive gases. The selectivity can be varied over several orders of magnitude making it possible to compress or stretch surface profiles during the pattern transfer.…”
Section: Methodsmentioning
confidence: 99%
“…Gas-phase reactive ion etching (RIE) technology is a highly anisotropic etching technology for micro-/nanofabrication . According to the properties of the etched object, the reactive plasmas used can be charged particles, excited neutrals, or radicals. For example, RIE using a mixture of O 2 and CHF 3 has been used to etch silica NPs to obtain the desired nanostructures .…”
Section: Introductionmentioning
confidence: 99%
“…Ion milling utilizing noble gas ions can be used for etching materials which cannot easily be etched chemically [5]. Laser ablation [6,7], which is also used for producing distinct * Tel.…”
Section: Introductionmentioning
confidence: 99%