A Review of Manufacturing Methods for Flexible Devices and Energy Storage Devices

Abstract

Given the advancements in modern living standards and technological development, conventional smart devices have proven inadequate in meeting the demands for a high-quality lifestyle. Therefore, a revolution is necessary to overcome this impasse and facilitate the emergence of flexible electronics. Specifically, there is a growing focus on health detection, necessitating advanced flexible preparation technology for biosensor-based smart wearable devices. Nowadays, numerous flexible products are available on the market, such as electronic devices with flexible connections, bendable LED light arrays, and flexible radio frequency electronic tags for storing information. The manufacturing process of these devices is relatively straightforward, and their integration is uncomplicated. However, their functionality remains limited. Further research is necessary for the development of more intricate applications, such as intelligent wearables and energy storage systems. Taking smart wear as an example, it is worth noting that the current mainstream products on the market primarily consist of bracelet-type health testing equipment. They exhibit limited flexibility and can only be worn on the wrist for measurement purposes, which greatly limits their application diversity. Flexible energy storage and flexible display also face the same problem, so there is still a lot of room for development in the field of flexible electronics manufacturing. In this review, we provide a brief overview of the developmental history of flexible devices, systematically summarizing representative preparation methods and typical applications, identifying challenges, proposing solutions, and offering prospects for future development.

Laser Sintering Direct Ink Write Silver Nanoflake Ink for On-Demand Manufacturing of Electronics in Space

“…Direct-deposition printing of nanoparticle (NP) inks, or colloidal suspensions, is the primary process in PE fabrication to produce various electronic device features on flexible substrates [10][11][12][13]. Ink deposition methods include spin coating, inkjet printing (IJP), aerosol jet printing (AJP), and direct ink writing (DIW) [14][15][16]. Spin coating uses centrifugal force to spread the applied ink evenly on the substrate [17].…”