A review: green chemical mechanical polishing for metals and brittle wafers

Liu, Lu; Zhang, Zhenyu; Wu, Bin; Hu, Wei; Meng, Fanning; Li, Yubiao

doi:10.1088/1361-6463/ac0c4a

Cited by 31 publications

(8 citation statements)

References 154 publications

(161 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…29 As a typical strong and pollution-free oxidizer, H 2 O 2 was reported to be quite effective in increasing the MRR of stainless steels. 20 Zhang et al 30 also highlighted H 2 O 2 as an environmentalfriendly oxidant in the new green CMP slurry.…”

Section: Resultsmentioning

confidence: 99%

Two-Step Chemical Mechanical Polishing of Stainless Steel

Guo

et al. 2022

ECS J. Solid State Sci. Technol.

View full text Add to dashboard Cite

Stainless steel with high surface quality is required in many industries and chemical mechanical polishing can achieve both local and global planarization of the substrate surface. However, it is difficult to realize both high material removal rate and high surface quality by a single step polishing. In this regard, a two-step polishing process, coarse polishing with α-Al2O3 abrasives first and then fine polishing with silica abrasives, was proposed to solve the trade-off between material removal and surface quality. The effects of pH (1~12) and H2O2 (0~0.5wt%) on the polishing of 304 stainless steel disk (area ~6.7 cm2) were systematically studied and CMP mechanism of stainless steel was discussed. The results indicated that, at pH 4, with the addition of 0.01wt% H2O2, the surface roughness of stainless steel was successfully reduced from 0.702 μm to 44.6 nm (the first step using α-Al2O3 abrasives) and 1.61 nm (the second step using silica abrasives). Finally, an ultra-smooth surface was obtained with decent material removal rate.

show abstract

Section: Resultsmentioning

confidence: 99%

Two-Step Chemical Mechanical Polishing of Stainless Steel

Guo

et al. 2022

ECS J. Solid State Sci. Technol.

View full text Add to dashboard Cite

show abstract

“…19 Meantime, the waste polishing solution will also produce a severe environmental pollution. 20 Therefore, a new green polishing solution is needed for the human body health and environment pollution condition. In this study, the Hank's solution was selected and used as the basic fluid due to the proximity of chemical composition with human body fluids, the detailed mass ratio is shown in Table II.…”

Section: Methodsmentioning

confidence: 99%

Preparation and Performance Testing of Green Non-toxic Polishing Solution for Medical Titanium Alloy

Zhang,

Zou,

Pang

et al. 2024

ECS J. Solid State Sci. Technol.

View full text Add to dashboard Cite

To obtain a lower toxic residue on medical titanium alloy surfaces in a chemical mechanical polishing (CMP) process, a new green polishing solution is proposed. The humoral fluid was selected as the basic solution in which the silica abrasive particles were used as the grinding particles, and H2O2 was added as the oxidant. A CMP test was carried out for its performance investigation with titanium alloy material. Then the surface roughness and material removal ratio were analyzed and compared with that of an existing polishing solution condition. Finally, the toxic residue of the titanium alloy samples was obtained by scanning electron microscopy. The experimental results indicate that a better material removal rate and surface roughness of titanium alloy with humoral polishing solution were obtained compared to existed polishing solution conditions. More importantly, the content of toxic elements on the sample surface was significantly reduced due to the greater amount of aluminum and vanadium ions dissolved in the polishing solution, which is more beneficial for its application in the medical prosthetics field. This study provides a new reference for the toxic residue reduction on the material surface of medical titanium alloy in CMP process.

show abstract

“…10,15 Inspired by this, green chemical mechanical polishing has attracted increasing attention for its environmental protection and mechanochemical collaborative process. [19][20][21] The expected CMP processing effect is based on the green environmental protection using friendly weak acids, weak bases, and even food grade reagents to prepare polishing slurry. Recently, some researchers have polished many materials and components (such as sapphire, diamond, and oxygen-free copper) with a green CMP process, and obtained extremely low surface roughness and ultra-smooth surface.…”

Section: Introductionmentioning

confidence: 99%