A review about the engineering design of optimal heat transfer systems using topology optimization

Dbouk, T.

doi:10.1016/j.applthermaleng.2016.10.134

Cited by 310 publications

(114 citation statements)

References 82 publications

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“…Therefore, many researchers are beginning to pursue an accurate solution to thermofluid topology optimization using full conjugate heat transfer models. Moreover, forced convection was initially investigated by [31] and [32] and has subsequently been extended by many authors, as is summarized in the review paper by [33]. Recently, turbulent fluid flow [34] and forced heat transfer [34] has been presented using a density-based topology optimization approach.…”

Section: Introductionmentioning

confidence: 99%

Topology optimization of heat sinks for instantaneous chip cooling using a transient pseudo-3D thermofluid model

Zeng

Wang

Yang

et al. 2020

International Journal of Heat and Mass Transfer

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With the increasing power density of electronics components, the heat dissipation capacity of heat sinks gradually becomes a bottleneck. Many structural optimization methods, including topology optimization, have been widely used for heat sinks. Due to its high design freedom, topology optimization is suggested for the design of heat sinks using a transient pseudo-3D thermofluid model to acquire better instantaneous thermal performance. The pseudo-3D model is designed to reduce the computational cost and maintain an acceptable accuracy. The model relies on an artificial heat convection coefficient to couple two layers and establish the approximate relationship with the corresponding 3D model. In the model, a constant pressure drop and heat generation rate are treated. The material distribution is optimized to reduce the average temperature of the base plate at the prescribed terminal time. Furthermore, to reduce the intermediate density regions during the density-based topology optimization procedure, a detailed analysis of interpolation functions is made and the penalty factors are chosen on this basis. Finally, considering the engineering application of the model, a practical model with more powerful cooling medium and higher inlet pressure is built.The optimized design shows a better instantaneous thermal performance and provides 66.7% of the pumping power reduction compared with reference design.

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Section: Introductionmentioning

confidence: 99%

Topology optimization of heat sinks for instantaneous chip cooling using a transient pseudo-3D thermofluid model

Zeng

Wang

Yang

et al. 2020

International Journal of Heat and Mass Transfer

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“…Despite the relative maturity of the field, few authors have explored the design of multimaterial, multifunctional structures that combine optimal elastic and thermal performance. Previous studies have individually addressed the topics of elastic response, thermal response, and multimaterial design …”

Section: Introductionmentioning

confidence: 99%

Multimaterial topology design for optimal elastic and thermal response with material‐specific temperature constraints

Kang

James

2018

Numerical Meth Engineering

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Summary We present an original method for multimaterial topology optimization with elastic and thermal response considerations. The material distribution is represented parametrically using a formulation in which finite element–style shape functions are used to determine the local material properties within each finite element. We optimize a multifunctional structure that is designed for a combination of structural stiffness and thermal insulation. We conduct parallel uncoupled finite element analyses to simulate the elastic and thermal response of the structure by solving the two‐dimensional Poisson problem. We explore multiple optimization problem formulations, including structural design for minimum compliance subject to local temperature constraints so that the optimized design serves as both a support structure and a thermal insulator. We also derive and implement an original multimaterial aggregation function that allows the designer to simultaneously enforce separate maximum temperature thresholds based upon the melting point of the various design materials. The nonlinear programming problem is solved using gradient‐based optimization with adjoint sensitivity analysis. We present results for a series of two‐dimensional example problems. The results demonstrate that the proposed algorithm consistently converges to feasible multimaterial designs with the desired elastic and thermal performance.

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“…Various topology optimization methods have been presented to maximize the thermal efficiency of engineering systems considering conduction, convection and conjugate heat transfer (Dbouk 2017). In this paper, we consider conductive problems, as the first step towards more complicated and realistic problems.…”

Section: Introductionmentioning

confidence: 99%

Topology optimization of conductive heat transfer problems using parametric L-systems

Ikonen

Marck

Sóbester

et al. 2018

Struct Multidisc Optim

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Generative encodings have the potential of improving the performance of evolutionary algorithms. In this work we apply parametric L-systems, which can be described as developmental recipes, to evolutionary topology optimization of widely studied two-dimensional steady-state heat conduction problems. We translate L-systems into geometries using the turtle interpretation, and evaluate their objective functions, i.e. average and maximum temperatures, using the Finite Volume Method (FVM). The method requires two orders of magnitude fewer function evaluations, and yields better results in 10 out of 12 tested optimization problems (the result is statistically significant), than a reference method using direct encoding. Further, our results indicate that the method yields designs with lower average temperatures than the widely used and well established SIMP (Solid Isotropic Material with Penalization) method in optimization problems where the product of volume fraction and the ratio of high and low conductive material is less or equal to 1. Finally, we demonstrate the ability of the methodology to tackle multi-objective optimization problems with relevant temperature and manufacturing related objectives.

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A review about the engineering design of optimal heat transfer systems using topology optimization

Cited by 310 publications

References 82 publications

Topology optimization of heat sinks for instantaneous chip cooling using a transient pseudo-3D thermofluid model

Topology optimization of heat sinks for instantaneous chip cooling using a transient pseudo-3D thermofluid model

Multimaterial topology design for optimal elastic and thermal response with material‐specific temperature constraints

Topology optimization of conductive heat transfer problems using parametric L-systems

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