A reusable planar triggered spark-gap switch batched-fabricated with PCB technology for medium- and low-voltage pulse power systems

Yang, Zhi; Wang, Ke; Zhu, Peng; Liu, Peng; Qiu, Zhang; Xu, Cong; Jian, Hao-tian; Shen, Ruiqi

doi:10.1016/j.dt.2020.11.017

Cited by 8 publications

(8 citation statements)

References 21 publications

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“…The grain size of Cu foil is closely related to the sputtering power, and the sputtering rate is directly proportional to the sputtering power. The expression of the sputtering rate is shown in Equation (2).…”

Section: The Test Resultsmentioning

confidence: 99%

“…The shape and material nature of Cu foil, which affects the energy deposition, plasma output ability and flyer velocity, is the most researched topic on exploding foil detonators [1][2][3], which are considered as the key materials for electronic safe and arm systems for rocket motor ignition, fuzing, ammunition, and flight termination applications [4][5][6][7][8][9][10][11][12]. The velocity and shape of the flyer are two key factors that affect the energy-output effect of exploding foil initiators.…”

Section: Introductionmentioning

confidence: 99%

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Effect of Grain Size and Micromorphology of Cu Foil on the Velocity of Flyer of Exploding Foil Detonator

Han

Deng

Chu³

et al. 2021

Applied Sciences

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In this paper, the effect of grain size and micromorphology of Cu foil on the velocity of the flyer of an exploding foil detonator was studied. A Cu foil with different grain sizes and micromorphologies was prepared by the physical vapor deposition sputtering method. The flyer velocity of the Cu foil was measured by the photon Doppler technique (PDT). The influence of the grain size and micromorphology of the Cu foil (which was the core transducer of the exploding foil detonator) on the flyer velocity and reacted morphology was discussed. The results show that the grain size and micromorphology of the Cu film can greatly affect the velocity and morphology of the flyer. The grain size of the Cu film is more uniform, and the stimulus response in the middle area of the bridge foil is more concentrated. In addition, the current density becomes more uniform, resulting in a better explosion performance. Consequently, the speed of the formed flyer becomes higher, leading to a smoother flyer surface, which is more conductive to energy conversion.

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Section: The Test Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Effect of Grain Size and Micromorphology of Cu Foil on the Velocity of Flyer of Exploding Foil Detonator

Han

Deng

Chu³

et al. 2021

Applied Sciences

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“…Studies on mode 1 can be found in our previous work. In mode 2, which is more similar to trigger gas switches [14][15][16], the conduction current, delay, and jitter are important parameters that are used to evaluate device performance.…”

Section: Introductionmentioning

confidence: 99%

Source–drain switching characteristics when coupled with a gate-controlled DBD in a microplasma switch

Chen,

Wang,

et al. 2024

J. Phys. D: Appl. Phys.

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Microplasma switches have attracted much attention in harsh environment applications such as satellites, space exploration, nuclear reactors and oil drilling because of their inherent characteristics. Microplasma switch is generally constructed by source, drain, and gate electrodes, current conduction is generated between drain and source (DS), and modulated by gate. In this work, to improve the gate lifespan and device stability, a microplasma switch with gate dielectric barrier structure was fabricated due to the even and stable discharge of dielectric barrier discharge (DBD) and a parameterized nanosecond pulse voltage signal was applied to the gate. Under the effect of the DS voltage, pulsed DS current is triggered by gate pulse since a large number of charged particles are generated with gate DBD, which shows the DS switching behavior triggered by gate pulse. The microplasma switch operates stably(with an average delay jitter of less than 50 ps) at the repetition frequencies (up to 80 kHz), moreover, the influence of experimental conditions on switching performance is systematically investigated. Conduction current and delay, which related to discharge intensity and speed, are influenced by electric field strength of channel (decided by pulse amplitude and DS voltage) and its variation rate (decided by rising and falling edge time of pulse). In addition, it is influenced by varying breakdown voltage of DS (decided by pd, i.e., gas pressure times DS spacing), which can result in working coefficient variation. It is also influenced by varying wall voltage (decided by pulse width and frequency), which can result in the decreases of total voltage of channel.

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“…A more uniformly distributed metal film that adheres more robustly to the substrate typically promotes better electrical explosion performance and necessitates lower energy to initiate the explosion. The film-forming quality of the foils used in exploded foil metal bridges mainly depends on the processing techniques used, which mainly include magnetron sputtering coatings for micro-electro-mechanical system (MEMS) technology, gap screen printing film-forming for low-temperature co-fired ceramic (LTCC) processes, and electroplating film-forming for printed circuit board (PCB) processes [26][27][28][29][30]. Of these, magnetron sputtering stands out as yielding the highest quality of films with great purity, superior density, and minimal surface roughness, usually around 10 nm.…”

Section: Introductionmentioning

confidence: 99%

A Micro Bridge-Wing-Thickened Low-Energy Exploding Foil Initiator Chip

Xue,

Hu,

Wang

et al. 2024

Micromachines

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To enhance the energy efficiency of exploding foil initiator systems (EFIs) and mitigate energy loss due to ablation in the bridge-wing regions, a low-energy bridge-wing-thickened EFI chip was designed and fabricated. Computational analysis revealed that increasing the thickness of the bridge flanks significantly reduces ablation within the bridge region during the electrical explosion. The refinement of the design led to the adoption of a bridge flank thickness of 19 μm, with the bridge area dimensions specified as 0.25 mm × 0.25 mm × 4 μm. This bridge-wing-thickened EFI chip was produced by employing micro-electro-mechanical systems (MEMS) technology and underwent rigorous performance evaluations. The empirical results closely matched the computational predictions, thereby corroborating the precision of the proposed model in simulating the temperature distribution seen during the explosion process. Notably, this enhanced EFI design achieves a flyer velocity of 3800 m/s at a condition of 900 V/0.22 μF, signifying a significant advancement in EFI system efficiency and performance.

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A reusable planar triggered spark-gap switch batched-fabricated with PCB technology for medium- and low-voltage pulse power systems

Cited by 8 publications

References 21 publications

Effect of Grain Size and Micromorphology of Cu Foil on the Velocity of Flyer of Exploding Foil Detonator

Effect of Grain Size and Micromorphology of Cu Foil on the Velocity of Flyer of Exploding Foil Detonator

Source–drain switching characteristics when coupled with a gate-controlled DBD in a microplasma switch

A Micro Bridge-Wing-Thickened Low-Energy Exploding Foil Initiator Chip

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