A resonantly excited 2D-micro-scanning-mirror with large deflection

Schenk, Harald; Dürr, Peter; Kunze, Detlef; Lakner, Hubert; Heinz, Kuehn

doi:10.1016/s0924-4247(00)00529-x

Cited by 109 publications

(63 citation statements)

References 4 publications

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“…With (100) wafer, diverse MEMS devices such as accelerometer [44][45][46][47][48], micro optical clips [49][50], acoustic transducers [51], and scanning micro mirrors [52][53] have been fabricated. The reason that (100) wafer is preferred lies in the orientations of (111) planes in it.…”

Section: Wet Etching Of (100) Silicon Wafermentioning

confidence: 99%

Ultrasonic Transducers

2014

Ultrasonic Technology for Desiccant Regeneration

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Section: Wet Etching Of (100) Silicon Wafermentioning

confidence: 99%

Ultrasonic Transducers

2014

Ultrasonic Technology for Desiccant Regeneration

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“…However, trench isolation in SOI does not provide mechanical coupling. Therefore, to achieve mechanical coupling with electrical isolation, backfilling an isolation trench with an additional deposition of a dielectric layer followed by chemical mechanical polishing (CMP) has been used [28]. However, the additional deposition and CMP steps add significant complexity and cost.…”

Section: Microlensmentioning

confidence: 99%

Single Molecular Detection via Micro-Scale Polymeric Opto-Electro-Mechanical Systems

Lee¹,

Pisano²,

Pruitt³

et al. 2005

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“…However, trench isolation in SOI wafer does not provide mechanical coupling. Therefore, backfilling an isolation trench with additional deposition of dielectric layer followed by chemical mechanical polishing (CMP) has been used to achieve the mechanical coupling with electrical isolation [9]. However, the additional deposition and the CMP steps add significant complexity and cost.…”

Section: Ilicon-on-insulatormentioning

confidence: 99%

Vertical Combdrive Based 2-D Gimbaled Micromirrors With Large Static Rotation by Backside Island Isolation

Kwon

Milanović

Lee

2004

IEEE J. Select. Topics Quantum Electron.

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Abstract-We introduce a backside island isolation method for silicon-on-insulator (SOI)-based microelectromechanical systems technology and demonstrate vertical comb drive-based two-dimensional gimbaled micromirrors with large static rotation using the isolation method. The proposed isolation method provides electrical isolation and mechanical coupling of SOI structures without additional dielectric backfill and planarization by utilizing timed etched backside handle wafer structures. The backside island is a hidden layer beneath the gimbal and allows independent application of actuation potentials to the gimbal and inner mirror. We developed the fabrication process that accommodates the backside island isolation structures into an established vertical comb drive process, thereby allowing implementation of two-axis gimbaled structures. The maximum static optical deflections of the gimbal and mirror are 46 and 15 , respectively. Index Terms-Backside island isolation, deep reactive ion etching (DRIE), micromirror, raster scanning, silicon-on-insulator (SOI), two-axis scanner, two-dimensional (2-D) scanner, vertical combdrive.

show abstract

A resonantly excited 2D-micro-scanning-mirror with large deflection

Cited by 109 publications

References 4 publications

Ultrasonic Transducers

Ultrasonic Transducers

Single Molecular Detection via Micro-Scale Polymeric Opto-Electro-Mechanical Systems

Vertical Combdrive Based 2-D Gimbaled Micromirrors With Large Static Rotation by Backside Island Isolation

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