A research on benzoxazine/cyanate ester/epoxy POSS nanocomposite with low dielectric constant and improved toughness

Li, Xiaodan; Liu, Xiaoqing; Feng, Jiacheng; He, Rui; Liu, Hongyu; Li, Xiaoping

doi:10.1007/s00289-023-04694-9

Cited by 8 publications

(8 citation statements)

References 43 publications

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“…[189] In this context, BAa/BADCy/EPPOSS nanocomposites were prepared via the curing reaction of epoxy POSS with a flexible ether bond, in conjunction with bisphenol A benzoxazine (BA-a) and BADCy. [190] In the realm of thermoplastics, polyhydroxy ether (PHE) stands out due to its exceptional mechanical properties, dimensional stability, and low temperature ductility. [191] Further, the presence of hydroxyl groups along the PHE chain allows for their interaction with the cyanate ester groups (-OCN), facilitating the formation of triazene, and consequently, lowering the curing temperature.…”

Section: Cyanate Ester Resinsmentioning

confidence: 99%

The Recent Advances of Polymer–POSS Nanocomposites With Low Dielectric Constant

Miao,

Zhan,

Liao

et al. 2024

Macromol. Rapid Commun.

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This study provides a comprehensive overview of the preparation methods for polyhedral oligomeric silsesquioxane (POSS) monomers and polymer/POSS nanocomposites. It focuses on the latest advancements in using POSS to design polymer nanocomposites with reduced dielectric constants. The study emphasizes exploring the potential of POSS, either alone or in combination with other materials, to decrease the dielectric constant and dielectric loss of various polymers, including polyimides, bismaleimide resins, poly(aryl ether)s, polybenzoxazines, benzocyclobutene resins, polyolefins, cyanate ester resins, epoxy resins, and more. Additionally, the research investigates the impact of incorporating POSS on improving the thermal properties, mechanical properties, surface properties, and other aspects of these polymers. The entire study is divided into two parts, discussing systematically the role of POSS in reducing dielectric constants during the preparation of POSS composites using both physical blending and chemical synthesis methods. The goal of this research is to provide valuable strategies for designing a new generation of low dielectric constant materials suitable for large‐scale integrated circuits in the semiconductor materials domain.This article is protected by copyright. All rights reserved

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Section: Cyanate Ester Resinsmentioning

confidence: 99%

The Recent Advances of Polymer–POSS Nanocomposites With Low Dielectric Constant

Miao,

Zhan,

Liao

et al. 2024

Macromol. Rapid Commun.

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“…[ 85 ] POSS‐based epoxy monomer EPPOSS was synthesized by Li et al . [ 86 ] and copolymerized with benzoxazine and cyanate ester to obtain the cured resins with low D k of 2.72 (Figure 3.10). DDSQ‐based epoxy monomer TG‐POSS was developed by Ma et al ., and cured with bisphenol A (BPA) or hexafluoro‐bisphenol A (FBPA).…”

Section: Organosilicon Polymers For Low‐k Materials Applicationmentioning

confidence: 99%

Recent Advance in Low‐Dielectric‐Constant Organosilicon Polymers

2023

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Comprehensive SummaryLow dielectric (low‐k) organosilicon polymers have received extensive interests from industry and academia due to good electrical insulation, high temperature resistance, flame retardancy and hydrophobicity. These attractive properties enable them to be utilized as low‐k materials in fabrication of electronic devices in high‐frequency communication technology. This review summarizes recent progress in developing low‐k organosilicon polymers, including the synthetic methods and properties of different organosilicon polymers classified according to the chemical structures. It may provide some inspiration to design new low‐k organosilicon polymers for application in the future.

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“…The rigid benzoxazole moiety increased intermolecular distance, increased free volume, and reduced inter-nanoparticle agglomeration (Figure 9a). Li et al [63] synthesized an epoxy-modified POSS(EPPOSS) (Figure 8a) and copolymerized it with bisphenol A cyanate (BADCy) and bisphenol A benzoxazine (BA-a) (Figure 9b). The dielectric constant decreased to 2.72 with 15 wt% EPPOSS, but severe agglomeration occurred at 20 wt%, leading to decreased cross-linking density and increased dielectric constant.…”

Section: Low Dielectric Benzoxazine-based Nanocompositesmentioning

confidence: 99%

Recent Progress of Low Dielectric and High-Performance Polybenzoxazine-Based Composites

Fan,

Li,

Ren

et al. 2023

Polymers

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With the rapid advancement of intelligent electronics, big data platforms, and other cutting-edge technologies, traditional low dielectric polymer matrix composites are no longer sufficient to satisfy the application requirements of high-end electronic information materials, particularly in the realm of high integration and high-frequency, high-speed electronic communication device manufacturing. Consequently, resin-based composites with exceptional low dielectric properties have garnered unprecedented attention. In recent years, benzoxazine-based composites have piqued the interest of scholars in the fields of high-temperature-resistant, low dielectric electronic materials due to their remarkable attributes such as high strength, high modulus, high heat resistance, low curing shrinkage, low thermal expansion coefficient, and excellent flame retardancy. This article focuses on the design and development of modification of polybenzoxazine based on low dielectric polybenzoxazine modification methods. Studies on manufacturing polybenzoxazine co-polymers and benzoxazine-based nanocomposites have also been reviewed.

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A research on benzoxazine/cyanate ester/epoxy POSS nanocomposite with low dielectric constant and improved toughness

Cited by 8 publications

References 43 publications

The Recent Advances of Polymer–POSS Nanocomposites With Low Dielectric Constant

The Recent Advances of Polymer–POSS Nanocomposites With Low Dielectric Constant

Recent Advance in Low‐Dielectric‐Constant Organosilicon Polymers

Recent Progress of Low Dielectric and High-Performance Polybenzoxazine-Based Composites

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