2021
DOI: 10.1016/j.microrel.2021.114124
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A remaining useful life prediction method of IGBT based on online status data

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Cited by 6 publications
(8 citation statements)
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“…Thermal stress failure refers to the fracture of the bonding layer or the falling off of the bonding wire of the device caused by thermal stress, which increases the thermal resistance of the chip, and thus causes changes in some characteristic parameters of the device, and this is the main reason for the aging device. Therefore, the current research on the aging failure of IGBT devices mainly refers to the aging failure of devices caused by thermal stress [16]. Unlike electrical stress failure, thermal stress failure is caused by long-time use of the device, which is predictable and can therefore be used for life prediction.…”
Section: Cause Analysis Of Failurementioning
confidence: 99%
“…Thermal stress failure refers to the fracture of the bonding layer or the falling off of the bonding wire of the device caused by thermal stress, which increases the thermal resistance of the chip, and thus causes changes in some characteristic parameters of the device, and this is the main reason for the aging device. Therefore, the current research on the aging failure of IGBT devices mainly refers to the aging failure of devices caused by thermal stress [16]. Unlike electrical stress failure, thermal stress failure is caused by long-time use of the device, which is predictable and can therefore be used for life prediction.…”
Section: Cause Analysis Of Failurementioning
confidence: 99%
“…The studies [ 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 , 15 , 16 , 17 , 18 , 19 , 20 , 21 , 22 , 23 , 24 ] show that the IGBT failure precursor parameters can directly or indirectly reflect the health state of the IGBT, mainly including collector-emitter voltage (V CE ), gate-emitter threshold voltage (V GEth ), collector shutdown current (I C ), gate leakage current (I G ), junction temperature and thermal resistance, etc.…”
Section: Analysis Of Igbt Failure Modes and Their Precursor Parametersmentioning
confidence: 99%
“…Due to the decline in V CE caused by chip bonding and the loss of bonding wires, the increase in V CE value has a high impact, and it is generally believed that the V CE value increases as IGBT ages. The V CE is the most commonly used health monitoring parameter due to its easy detection of V CE through sensors under laboratory conditions [ 13 , 14 , 15 , 16 , 17 , 18 , 19 , 20 ]. The part of the shutdown current I C in the slow falling phase of the IGBT is called the tail current, and the shutdown current duration can be used as a performance parameter to characterize the IGBT latch-up effect, so the tailing current can also be used as an electrical parameter to characterize the IGBT latch-up effect.…”
Section: Analysis Of Igbt Failure Modes and Their Precursor Parametersmentioning
confidence: 99%
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