2022 20th IEEE Interregional NEWCAS Conference (NEWCAS) 2022
DOI: 10.1109/newcas52662.2022.9842234
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A Reconfigurable Power System-in-Package Module using GaN HEMTs and IC Bare Dies on LTCC Substrate: Design - Implementation - Experiment and Future Directions

Van Ha Nguyen
1
,
Nueraimaiti Aimaier
2
,
Gabriel Nobert
3
et al.
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