A readout IC for an uncooled microbolometer infrared FPA with on-chip self-heating compensation in 0.35 μm CMOS

Svärd, Daniel; Jansson, Christer; Alvandpour, Atila

doi:10.1007/s10470-013-0116-9

Cited by 15 publications

(6 citation statements)

References 5 publications

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“…Infrared imaging using uncooled microbolometer detectors has been drawing much attention in recent years owing to its low cost and wide military and civilian applications. Uncooled microbolometer detectors operate at room temperature, which eliminates the need for cryogenic cooling [5]. High thermal isolation maximizes the sensitivity of the thermal detector [6,7].…”

Section: Introductionmentioning

confidence: 99%

“…2 Journal of Sensors Microbolometer detector arrays are fabricated using the microelectromechanical systems (MEMS) technology [5,9]. Due to the variability within the material and process, each fabricated microbolometer has a different nominal resistance value corresponding to the same infrared radiation that introduces the FPN in detector arrays [1,2,10].…”

Section: Introductionmentioning

confidence: 99%

“…Electrical biasing generates Joule heating and causes a change in the resistance of the microbolometer. This heating effect is referred to as the self-heating of the microbolometer [5,10]. Although the bias duration is usually very small as compared to the thermal time constant of the microbolometer, it significantly increases the temperature of the microbolometer.…”

Section: Introductionmentioning

confidence: 99%

“…The bias current should not be low enough such that it reduces the responsivity of the microbolometer [17]. A common compensation technique is to use a row of blind microbolometers that serves as a reference microbolometer [1,5,13,18]. A blind microbolometer is identical to a normal microbolometer but is not affected by incoming incident radiation; thus, it is only subjected to self-heating.…”

Section: Introductionmentioning

confidence: 99%

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Simulation and Analysis of Uncooled Microbolometer for Serial Readout Architecture

Alhussein

Haider

2016

Journal of Sensors

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A detailed thermal behavior and theoretical analysis of uncooled resistive microbolometer is presented along with the proposed thermal imager simulator. An accurate model of a thermal detector is required to design a readout circuit that can compensate for the noise due to process variability and self-heating. This paper presents a realistic simulation model of microbolometer that addresses the fixed pattern noise, Johnson noise, and self-heating. Different simulations were performed to study the impact of infrared power and bias power on the performance of microbolometers. The microbolometers were biased with different bias currents along with different thermal parameters of the reference microbolometer to analyze the impact of self-heating on the thermal image. The proposed thermal imager simulator is used as a tool to visually analyze the impact of noise on the quality of a thermal image. This simulator not only helps in compensating the noise prior to the implementation in Analog Design Environment, but also can be used as a platform to explore different readout architectures. In this work, serial readout architecture was simulated with a row of blind microbolometers that served as a reference. Moreover, the algorithm for the proposed thermal imager simulator is presented.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Simulation and Analysis of Uncooled Microbolometer for Serial Readout Architecture

Alhussein

Haider

2016

Journal of Sensors

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“…Thus, large α values suggest that a small change in the temperature on the sensing material will result in a large change on its resistance. The second figure of merit is the voltage responsivity R v (Equation (4)) [25],…”

Section: Thermographic Imagingmentioning

confidence: 99%

Characterization and Performance of a Thermal Camera Communication System

Guerra

Ticay-Rivas

Alonso-Eugenio

et al. 2020

Sensors

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This work presents a novel communications technology named Thermal Camera Communication (TCC), which is analogous to Optical Camera Communication (OCC). Thermographic cameras and Peltier cells are proposed as receiver and transmitter, respectively, changing completely their usual field of application. Furthermore, a comprehensive characterization of the Peltier–Thermal camera pair is carried out, presenting their bandwidth, achievable data rate under On-Off-Keying (OOK) modulation, noise characteristics, and energy efficiency. A comparison against the current state-of-the-art OCC technology is also provided, showing that TCC is a promising technology suitable for sensor networks. The thorough analysis of TCC performed in this work shows that commercial Peltier cells can be re-thought under a communications viewpoint in order to improve their performance. This novel communication technology can be applied in environments such as the access to public transportation or buildings due to the new health emergency situation. The use of thermographic cameras will become massive and dual measurement and communication purposes could be considered for applications such as sensor networks, using a yet unexploited wavelength range.

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A mismatch compensated readout IC for an uncooled microbolometer infrared FPA

Mosavi

Moezzi

2020

AEU - International Journal of Electronics and Communications

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A readout IC for an uncooled microbolometer infrared FPA with on-chip self-heating compensation in 0.35 μm CMOS

Cited by 15 publications

References 5 publications

Simulation and Analysis of Uncooled Microbolometer for Serial Readout Architecture

Simulation and Analysis of Uncooled Microbolometer for Serial Readout Architecture

Characterization and Performance of a Thermal Camera Communication System

A mismatch compensated readout IC for an uncooled microbolometer infrared FPA

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