Abstract:In this study, a novel phthalonitrile monomer containing a pyridazine ring, 3,6-bis[3-(3,4-dicyanophenoxy)phenoxy]pyridazine (BCPD) with a low melting point (74 °C) and wide processing window (178 °C), was prepared by a nucleophilic substitution reaction. The molecular structure of the BCPD monomer was identified by Fourier transform infrared spectroscopy (FTIR), and nuclear magnetic resonance spectroscopy (NMR). Poly(BCPD) resins were derived from the formulations by curing at 350 and 370 °C. The thermoset th… Show more
“…This indicates that the added HCCP-SA can decompose and absorb the energy of the system at a lower temperature, reducing the decomposition rate and T max of the E-HS- x composites, and thus, preventing further degradation of the EP resin matrix. In a word, the multiple-ring cross-linking network structure composed of the benzene ring, P-N, and N-O heterocycles is the main reason why E-HS- x composites have outstanding heat resistance [ 24 ].…”
A novel multiple-ring molecule containing P and N, called HCCP-SA, was successfully prepared by the nucleophilic substitution reaction of salicylamide (SA) and hexachlorocyclotriphosphazene (HCCP). Particularly, HCCP-SA possessed the dual functions of heat resistance and flame retardancy. The molecular structure of HCCP-SA was identified by Fourier transform infrared spectroscopy and nuclear magnetic resonance spectroscopy. HCCP-SA was bonded into the molecular chain of epoxy resin by the ring-opening curing reaction of epoxy resin, aiming to form a heat-resistant and flame-retardant composite (E-HS-x). In particular, the best-prepared E-HS-x composite with a 20 phr content of HCCP-SA (E-HS-20) presented excellent thermal stability, with an initial decomposition temperature of 267.94 °C and a max weight loss speed of only 0.95 mg·min−1. Moreover, E-HS-20 exhibited remarkable flame retardancy with a limiting oxygen index value of 27.1% and a V-2 rating in the UL94 flame retardancy test. The best-prepared E-HS-20 composite would be a suitable and potential candidate for heat-resistant and flame-retardant polymer materials.
“…This indicates that the added HCCP-SA can decompose and absorb the energy of the system at a lower temperature, reducing the decomposition rate and T max of the E-HS- x composites, and thus, preventing further degradation of the EP resin matrix. In a word, the multiple-ring cross-linking network structure composed of the benzene ring, P-N, and N-O heterocycles is the main reason why E-HS- x composites have outstanding heat resistance [ 24 ].…”
A novel multiple-ring molecule containing P and N, called HCCP-SA, was successfully prepared by the nucleophilic substitution reaction of salicylamide (SA) and hexachlorocyclotriphosphazene (HCCP). Particularly, HCCP-SA possessed the dual functions of heat resistance and flame retardancy. The molecular structure of HCCP-SA was identified by Fourier transform infrared spectroscopy and nuclear magnetic resonance spectroscopy. HCCP-SA was bonded into the molecular chain of epoxy resin by the ring-opening curing reaction of epoxy resin, aiming to form a heat-resistant and flame-retardant composite (E-HS-x). In particular, the best-prepared E-HS-x composite with a 20 phr content of HCCP-SA (E-HS-20) presented excellent thermal stability, with an initial decomposition temperature of 267.94 °C and a max weight loss speed of only 0.95 mg·min−1. Moreover, E-HS-20 exhibited remarkable flame retardancy with a limiting oxygen index value of 27.1% and a V-2 rating in the UL94 flame retardancy test. The best-prepared E-HS-20 composite would be a suitable and potential candidate for heat-resistant and flame-retardant polymer materials.
“…With the modernization and intelligent development of high technology sectors such as aerospace, electric motors, electronics and automobiles, polymer‐based composites with better overall performance are increasingly in demand. Phthalonitrile (PN) resin, a new type of high‐temperature resistant resin, has attracted a wide range of interest, 1 for its high glass transition temperature, 2 outstanding thermal and mechanical properties, 3–6 low water absorptivity 7 and superior flame resistance 8–10 . As one of the promising matrix materials for advanced composites, the mechanical properties of phthalonitrile can be further improved through fiber reinforcement 11 .…”
Section: Introductionmentioning
confidence: 99%
“…Phthalonitrile (PN) resin, a new type of hightemperature resistant resin, has attracted a wide range of interest, 1 for its high glass transition temperature, 2 outstanding thermal and mechanical properties, [3][4][5][6] low water absorptivity 7 and superior flame resistance. [8][9][10] As one of the promising matrix materials for advanced composites, the mechanical properties of phthalonitrile can be further improved through fiber reinforcement. 11 With years of exploration, PN composites have had a lot of theoretical and experimental basis in terms of the fabrication process, and some works of literature have been reported on the innovations and breakthroughs of curing mechanisms, and resin as well as fiber modification.…”
The development of lightweight composites with desirable thermo‐mechanical properties is progressively increasing. Phthalonitrile (PN) based composites have shown great potential in this regard. However, the basic thermal properties of PN composites required for engineering design are not yet fully understood. In this work, we investigated the thermal stability, thermal expansion behavior and thermal conductivity of PN composites reinforced with carbon fiber (CF) and high silicon fiberglass (HSF) via combined experimental studies and numerical simulations. The results indicated that CF/PN performs better in thermostability than HSF/PN at temperatures below 500°C. Moreover, the incorporation of CF and HSF lowered the coefficient of thermal expansion (CTE) and thermal insulation of PN. At room temperature, the in‐plane CTE of CF/PN and HSF/PN were 1.97E‐6 and 9.24E‐6°C−1, respectively, while the out‐plane thermal conductivities of CF/PN and HSF/PN were 0.65 and 0.34 W/(m K). It is worth noting that an excessively high fiber volume fraction would lead to poor thermal insulation and lightweight properties of the PN composites, while a low fiber volume fraction would result in poor stiffness and thermal dimensional stability. Determined via TOPSIS model, a fiber volume fraction range of 50%–60% was ideal for both composites with comprehensive optimal properties, respectively.
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