Abstract:This study examined the properties of Schottky-type diodes composed of Pt/TiO(2)/Ti, where the Pt/TiO(2) and TiO(2)/Ti junctions correspond to the blocking and ohmic contacts, respectively, as the selection device for a resistive switching cross-bar array. An extremely high forward-to-reverse current ratio of approximately 10(9) was achieved at 1 V when the TiO(2) film thickness was 19 nm. TiO(2) film was grown by atomic layer deposition at a substrate temperature of 250 degrees C. Conductive atomic force micr… Show more
“…Furthermore, both components will be required to be compatible with technologies such as threedimensional (3D) cell stacking, multi-level cell, endurance and scaling for future memory and switch devices 1,2 . Resistive random access memory has been considered to be one of the most promising candidates to overcome scaling limits of the conventional memory due to its scalability, data retention (nonvolatility), fast switching speed and low power consumption [3][4][5][6][7][8][9][10][11][12][13][14][15] . In a high-density memory system such as dynamic random access memory, a select device is required to suppress sneak current paths 3,8,9 .…”
Stackable select devices such as the oxide p-n junction diode and the Schottky diode (one-way switch) have been proposed for non-volatile unipolar resistive switching devices; however, bidirectional select devices (or two-way switch) need to be developed for bipolar resistive switching devices. Here we report on a fully stackable switching device that solves several problems including current density, temperature stability, cycling endurance and cycle distribution. We demonstrate that the threshold switching device based on As-Ge-Te-Si material significantly improves cycling endurance performance by reactive nitrogen deposition and nitrogen plasma hardening. Formation of the thin Si 3 N 4 glass layer by the plasma treatment retards tellurium diffusion during cycling. Scalability of threshold switching devices is measured down to 30 nm scale with extremely fast switching speed of B2 ns.
“…Furthermore, both components will be required to be compatible with technologies such as threedimensional (3D) cell stacking, multi-level cell, endurance and scaling for future memory and switch devices 1,2 . Resistive random access memory has been considered to be one of the most promising candidates to overcome scaling limits of the conventional memory due to its scalability, data retention (nonvolatility), fast switching speed and low power consumption [3][4][5][6][7][8][9][10][11][12][13][14][15] . In a high-density memory system such as dynamic random access memory, a select device is required to suppress sneak current paths 3,8,9 .…”
Stackable select devices such as the oxide p-n junction diode and the Schottky diode (one-way switch) have been proposed for non-volatile unipolar resistive switching devices; however, bidirectional select devices (or two-way switch) need to be developed for bipolar resistive switching devices. Here we report on a fully stackable switching device that solves several problems including current density, temperature stability, cycling endurance and cycle distribution. We demonstrate that the threshold switching device based on As-Ge-Te-Si material significantly improves cycling endurance performance by reactive nitrogen deposition and nitrogen plasma hardening. Formation of the thin Si 3 N 4 glass layer by the plasma treatment retards tellurium diffusion during cycling. Scalability of threshold switching devices is measured down to 30 nm scale with extremely fast switching speed of B2 ns.
“…23 Hence, in the case of bipolar-type memory cells, more complicated varistor type-elements with specific degrees of non-linearity (high current density and threshold voltage) are required at both polarities. 23 Recently, different concepts such as complementary resistance switches, 24,25 inherent rectifying resistance switching elements, 26 and Schottky interface based selection devices 27 have also been investigated to solve crosstalk problem for bipolar resistance switching based crossbar arrays.…”
We report on the comparison of the resistance switching properties and kinetic behavior of Cu doped Ge0.3Se0.7 solid electrolyte based dual layer memory devices integrated with asymmetrical (Pt and Cu) and symmetrical electrodes (only Cu). In spite of the fact that the observed resistance switching properties and its parameters are quite similar for both memory devices, the dependence of the SET-voltage on the voltage sweep rate suggests different microscopic rate limiting factors for the resistance switching behavior. Additionally, in order to alleviate the cross talk problem in passive crossbar arrays, a dual layer oxide stack (TiO2/Al2O3) is integrated with Ge0.3Se0.7 based dual layer memory devices to achieve a specific degree of non-linearity in the overall resistance of the low resistance state.
“…When three voltage variables are applied to T 1 , T 2 , T 3 respectively, the next states, and its present states S 1 , S 2 are described by (2). The output M and inputs T 1 , T 2 , T 3 , and present states S 1 , S 2 is described by (3).…”
Section: Designs and Simulationsmentioning
confidence: 99%
“…However, sneak path problem limits the size of the arrays and increases their power consumption. To solve the sneak path problem, various solutions were proposed, such as P-N junction type diode [2], Schottky type diode [3], complementary resistive switches (CRS) [4]. Among these proposed solutions, CRS is suitable for reducing parasitic current and making the application of large passive crossbar arrays feasible [4,5].…”
This paper designs a one-bit comparator and a one-bit half adder using complementary resistive switches (CRS) crossbar units. At first, the finite state machine (FSM) of the crossbar unit with two CRS cells is presented. Then, we demonstrate that the crossbar unit with a single CRS cell can realize the one-bit comparator in 7 sequential cycles, and the crossbar unit with two CRS cells which are connected via a wired AND ('&') can realize the one-bit half adder in 5 sequential cycles. Simulation results show that the one-bit comparator and the one-bit half adder can be designed to provide device area benefits via CRS crossbar units. The designs of one-bit comparator and one-bit half adder project the possibility of applications for complex circuit designs with CRS crossbar units.
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