A profilometric study of levelling in electroplating

Tidke, D. J.; Ramaswamy, N.

doi:10.1007/bf00611262

Cited by 3 publications

(3 citation statements)

References 6 publications

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“…The roughness amplitude was calculated by summing the absolute value of the departure of the surface height from the average surface line. This is a widely used measure of the roughness amplitude (36,37).…”

mentioning

confidence: 99%

Roughness Development in Metal Electrodeposition: I . Experimental Results

Barkey¹,

Müller²,

Tobias³

1989

J. Electrochem. Soc.

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Copper electroforms of thicknesses of several hundred micrometers were produced by deposition on a rotating cylinder at rates of up to 5.0 A/cm2, corresponding to 110 μm/min. Digitalized surface profiles were analyzed by Fourier transform. Decline of roughness wavelength is observed with increasing current density at constant fraction of limiting current, in agreement with stability theory. Decline in roughness amplitude was also observed. This decline is due to an increase in the number density of nuclei. A comparison of the growth of features inside and outside the hydrodynamic boundary layer lends support to the growth mechanism proposed by Ibl in 1980.

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mentioning

confidence: 99%

Roughness Development in Metal Electrodeposition: I . Experimental Results

Barkey¹,

Müller²,

Tobias³

1989

J. Electrochem. Soc.

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“…Deposition on damaged surfaces: Motivated by the observation that thicker iron-carbon coatings do not copy the substrate topography, but become smoother during growth, the substrate surface was intentionally damaged before deposition to investigate the ability of the iron-carbon coating to repair a worn surface. In general, levelling can be assessed by different means depending on the relevant dimensions [16,17]. For the present study, not the surface roughness on the nano- or microscale, but irregularities on the macroscale are of interest.…”

Section: Resultsmentioning

confidence: 99%

Repair of damaged surfaces with hard iron-carbon coatings

Erard

Nielsen

Pantleon

2022

Surface Engineering

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“…Some of the earliest uses of profilometry were by Ostrow and Nobel (74), (75), (76), who studied levelling phenomenon in acid and cyanide copper baths. More recently, Tidke and Ramaswamy (77) have used profilometry to study nickel levelling during electroplating. Also,-Alkire and Reiser (78) • used pro~lometry to measure the thickness of copper plated onto an array of parallel strips.…”

Section: • (C) Profilometrymentioning

confidence: 99%

Levelling of Microprofiles in Electrodeposition [Thesis]

Jordan

1990

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Theoretical analysis of moving boundaries in electrodeposition is addressed, focusing on the levelling of microscopic surface contours. The •literature relevant to the solution of current distribution problems is reviewed. Convection of inhibitors to the• depth of trenches is evaluated using the finite element method, and characterized as a function of Reynolds number, notch angle, and depth. Secondary flows are shown to noticeably enhance transport into microscopic trenches only at high Peclet numbers, i.e. at very high flow velocities.The boundary element method (BEM) is used to analyze levelling caused by inhibitors consumed at the transpon limiting rate during electrodeposition. It is predicted that (i) better levelling performance can be obtained if the microscopic surface waviness is oriented perpendicular to the convective flow, and (ii) for surface roughness oriented parallel to the flow, there is an optimum boundary layer thickness, or flux of additive, which results in superior levelling performance.Profilometry and photomicrography is applied to obtain the ~rrent distribution, current efficiency and levelling performance on novel microprofiled electrodes for two orientations with respect to the fluid flow during nickel electrodeposition in the presence of coumarin. Slightly bener'levelling occurs in flows transverse to grooves, and the deposit thickness increases in the flow direction. It is concluded that coumarin acts by simultaneously .Working with Professor Charles W. Tobias has been an excellent experience. His faith in students; common sense "advice for life," and sense of humour have made working in his group the quintessential graduate school experience.Thanks is owed to a number of other professors for their confidence in me, encomagement, and teaching. In particular, Professor Dennis Hess encouraged me to continue on in•graduate school. Professor David Graves introduced me to numerical methods. Professor John Newman taught me the -' . rigors of electrochemistry. The advice of Professor Roland Keunigs for modelling of the fluid flow is gratefully acknowledged.Appreciation of the friendship and collaboration of the Tobias-Muller group is also acknowledged. It is the people as well as the leader that have made this group fun to be in. The coconspirators in residence during my stay at Berkeley include:

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A profilometric study of levelling in electroplating

Cited by 3 publications

References 6 publications

Roughness Development in Metal Electrodeposition: I . Experimental Results

Roughness Development in Metal Electrodeposition: I . Experimental Results

Repair of damaged surfaces with hard iron-carbon coatings

Levelling of Microprofiles in Electrodeposition [Thesis]

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