2019
DOI: 10.1016/j.optlastec.2018.09.056
|View full text |Cite
|
Sign up to set email alerts
|

A processing technology of grooves by picosecond ultrashort pulse laser in Ni alloy: Enhancing efficiency and quality

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
5

Citation Types

2
13
0

Year Published

2020
2020
2023
2023

Publication Types

Select...
6
1

Relationship

0
7

Authors

Journals

citations
Cited by 30 publications
(15 citation statements)
references
References 21 publications
2
13
0
Order By: Relevance
“…A constant deepening rate of laser-processed grooves was achieved up to an aspect ratio (depth/width) of approximately 1.5 [6], which corresponds to the phase of constant depth progress observed in areal micromachining of metals [13] and silicon [14], where the aspect ratio is typically <1. The depth progress gradually slows down with increasing depth of the groove [6,8,9], reaching a limit when the absorbed fluence is reduced to the value of the ablation threshold everywhere on the walls of the groove [2]. This behavior corresponds to the one found for percussion drilling of microholes, where a decreasing rate of the depth progress was observed with the increasing number of applied pulses, which finally stagnated at the maximum reachable depth [15,16].…”
Section: Introductionmentioning
confidence: 70%
See 3 more Smart Citations
“…A constant deepening rate of laser-processed grooves was achieved up to an aspect ratio (depth/width) of approximately 1.5 [6], which corresponds to the phase of constant depth progress observed in areal micromachining of metals [13] and silicon [14], where the aspect ratio is typically <1. The depth progress gradually slows down with increasing depth of the groove [6,8,9], reaching a limit when the absorbed fluence is reduced to the value of the ablation threshold everywhere on the walls of the groove [2]. This behavior corresponds to the one found for percussion drilling of microholes, where a decreasing rate of the depth progress was observed with the increasing number of applied pulses, which finally stagnated at the maximum reachable depth [15,16].…”
Section: Introductionmentioning
confidence: 70%
“…The laser micromachined grooves with depths of a few tens up to several hundreds of micrometers typically feature a V-shaped geometry in metals [7,8], semiconductors [2,9], dielectrics [10] and polymers [11]. The resulting width of the grooves mainly depends on the diameter of the laser beam, the incident peak fluence and the material-specific ablation threshold [12].…”
Section: Introductionmentioning
confidence: 99%
See 2 more Smart Citations
“…Especially, the emerged high pulse electric-current and its current derivative may destroy suddenly some expensive electronic components, electronic circuits, and switchgears for the high-voltage transmission lines and others. The related technology of the high pulse electric-current and its current derivative can be applied in some research areas, for instance, the electromagnetic pulse technology [1,2,3], controlled fusion [4], thermal plasma [5], pulse laser technology [6], and high voltage process [7] and others.…”
Section: Introductionmentioning
confidence: 99%