A procedure to prevent pile up effects on the analysis of spherical indentation data in elastic–plastic materials

Rodrı́guez, J.; Garrido-Maneiro, Miguel Ángel

doi:10.1016/j.mechmat.2007.04.003

Cited by 40 publications

(23 citation statements)

References 16 publications

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“…Even though true contact areas were believed to be used to derive these elastic moduli, they were found to underestimate the true elastic modulus with decreasing contact depth. The results are consistent with the work of Maneiro and Rodríguez, 47,48 showing an increase in elastic modulus with increasing contact depth at the nanoscale. If the measured stiffness and contact area are correct, the error in the elastic modulus is most likely caused by frame compliance, by Eqs.…”

Section: B Reference Curve To Determine Effective Radiussupporting

confidence: 92%

Effective indenter radius and frame compliance in instrumented indentation testing using a spherical indenter

et al. 2009

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We introduce a novel method to correct for imperfect indenter geometry and frame compliance in instrumented indentation testing with a spherical indenter. Effective radii were measured directly from residual indentation marks at various contact depths (ratio of contact depth to indenter radius between 0.1 and 0.9) and were determined as a function of contact depth. Frame compliance was found to depend on contact depth especially at small indentation depths, which is successfully explained using the concept of an extended frame boundary. Improved representative stress-strain values as well as hardness and elastic modulus were obtained over the entire contact depth.

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Section: B Reference Curve To Determine Effective Radiussupporting

confidence: 92%

Effective indenter radius and frame compliance in instrumented indentation testing using a spherical indenter

et al. 2009

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“…However, in some cases there exists an apparent upward extrusion at the edge of the contact with the indenter in some metals, known as pile-up, which means that the actual contact area is larger than the value calculated by the Oliver-Pharr method [1]. Some studies have reported that the true contact area is 60% larger than the measured value as serious pile-up occurs, leading to the overestimation of the E and H [2][3][4][5][6][7]. Therefore, an understanding of the formation of the indentation pile-up in various materials and loading conditions under nanoindentation testing is invaluable.…”

Section: Introductionmentioning

confidence: 99%

“…It has been suggested that for materials with low work hardening ability, the amount of pile-up would become obvious as the ratio of h f /h max becomes larger than 0.7 [2,3]. Interestingly, most of the theoretical development reports were based on numerical modeling [5,[8][9][10][11][12], with very limited experimental data being used to explain this phenomenon. As for crystalline materials, it has been widely accepted that the grain boundary (GB) mediated deformation process can operate effectively in materials with a grain size smaller than 500 nm.…”

Section: Introductionmentioning

confidence: 99%

Nanoindentation-Induced Pile-Up in the Residual Impression of Crystalline Cu with Different Grain Size

Zhang

Sun

et al. 2017

Crystals

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Nanoindentation morphologies of crystalline copper have been probed at the grain scale. Experimental tests have been conducted on nanocrystalline (NC), ultrafine-grained (UFG), and coarse-grained (CG) copper samples with a new Berkvoich indenter at the strain rate of 0.04/s without holding time at an indentation depth of 2000 nm at room temperature. As the grain size increases, the height of the pile-up around the residual indentation increases and then exhibits a slightly decrease in the CG Cu. The maximum of the pile-up in the CG Cu obviously deviates from the center of the indenter sides. Our analysis has revealed that the dislocation motion and GB activities in the NC Cu, some cross-and multiple-slip dislocations inside the larger grain in the UFG Cu, and forest dislocations from the intragranular Frank-Read sources in the CG Cu would directly induce this distinct pile-up effect.

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“…Regarding experimental technique, nanoindentation experiment is capable to measuring the Young's modulus [9,10] based on a continuous stiffness measurement (CSM) technique [11], but the accuracy is affected by pile-up deformation at the indentation as the contact depth obtained from analytical analysis might be different than the actual one [12]. This will make the measured value for Young's modulus greater than the actual value.…”

Section: Introductionmentioning

confidence: 99%

Determination of Young’s Modulus of Tensile Specimen for Lead-Free Solder

Long¹,

Tang²,

Zhu³

et al. 2017

dtetr

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Abstract. In terms of geometry, various types of solder samples have been used in the literature to perform tensile experiment to investigate the mechanical behaviour of solder materials. Most of the studies focused on the plastic behaviour under complicated service environment. Nevertheless, there was usually no such a detailed description about Young's modulus due to the softness of solder material. In this paper, the disadvantages of existing experimental approaches to measure Young's modulus is discussed. In order to properly evaluate the magnitude of Young's modulus, finite element simulations are conducted for the dog-type tensile specimens which have been widely adopted for tension testing of metallic materials. Based on the elastic stage response, the Young's modulus can be corrected based on the proposed relationship between overestimated ratio of displacement and clamped length. Similarly, the Young's modulus of different types of tensile specimens can be assessed and corrected. This finite element-based approach can overcome the dramatic deformation at localized yielding positions along the gauge length when the applied stress is greater than the yield strength of solder material. More importantly, the correction does not influence the yielding and hardening stages.

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A procedure to prevent pile up effects on the analysis of spherical indentation data in elastic–plastic materials

Cited by 40 publications

References 16 publications

Effective indenter radius and frame compliance in instrumented indentation testing using a spherical indenter

Effective indenter radius and frame compliance in instrumented indentation testing using a spherical indenter

Nanoindentation-Induced Pile-Up in the Residual Impression of Crystalline Cu with Different Grain Size

Determination of Young’s Modulus of Tensile Specimen for Lead-Free Solder

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