A predictive model of grinding force in silicon wafer self-rotating grinding

Sun, Jie; Qin, Fei; Chen, Pei; An, Tong

doi:10.1016/j.ijmachtools.2016.07.009

Cited by 75 publications

(22 citation statements)

References 35 publications

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“…According to the grinding mechanism, these issues are mainly attributed to the large normal grinding force and the small tangential grinding force in the grinding process. 4–8 The ratio of normal grinding force to tangential grinding force is approximately three (i.e. frictional coefficient is ∼1/3) in the conventional grinding.…”

Section: Introductionmentioning

confidence: 99%

“…Hence, the ratio of normal force to tangential force is several times or even tens to hundreds of times larger than that for the grinding of ordinary materials. 6–8 This leads to more severe grinding issues for difficult-to-machine materials.…”

Section: Introductionmentioning

confidence: 99%

“…6,7 Great efforts have been made to develop the theoretical model which is able to predict the grinding force under different grinding conditions and reduce the impact of the grinding force on the grinding quality. 8–10 Chang and Wang 11 established a stochastic grinding force model considering random grit distribution. The spectrum characteristics of the grinding force were investigated in the frequency domain.…”

Section: Introductionmentioning

confidence: 99%

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A novel high-shear and low-pressure grinding method using specially developed abrasive tools

Tian

Fan

et al. 2020

Proceedings of the Institution of Mechanical Engineers, Part B:

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In this work, a novel grinding method using a special abrasive tool was first proposed to achieve high tangential grinding force and low normal grinding force. The abrasive tool was developed with flexible composites to remove workpiece materials under “high-shear and low-pressure” grinding mode. The concept of the high-shear and low-pressure grinding method was introduced in detail. Grinding tests were carried out on a precision grinder with the developed abrasive tool for single crystal silicon specimens. The results showed that the grinding force ratio between tangential force and normal force for the proposed grinding method was ranged between 0.9 and 1.3, which was three times larger than that of the conventional grinding method. It was verified that the developed abrasive tool possessed the grinding characteristics of high tangential grinding force and low normal grinding force. After grinding of silicon specimens for 120 min, the value of surface roughness decreased from 429.20 to 32.91 nm under the selected grinding conditions. The surface quality of the silicon specimens was greatly improved after grinding.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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A novel high-shear and low-pressure grinding method using specially developed abrasive tools

Tian

Fan

et al. 2020

Proceedings of the Institution of Mechanical Engineers, Part B:

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“…Schwandner et al invented a method for the double-side polishing of a semiconductor wafer and presented the construction for carrying out the method [4]. Sun et al established a predictive grinding-force model, as well as the relationship of subsurface crack depth and total normal grinding-force, to optimize the self-rotating grinding process for Si wafers [5]. Zhong et al analyzed the effects of different pre-polishing processes on the site flatness values of the finished wafers in wafer polishing [6].…”

Section: Introductionmentioning

confidence: 99%

Laser-based Thickness Control in a Double-Side Polishing System for Silicon Wafers

Zhu

Mei

Zhu

et al. 2020

Sensors

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Thickness control is a critical process of automated polishing of large and thin Si wafers in the semiconductor industry. In this paper, an elaborate double-side polishing (DSP) system is demonstrated, which has a polishing unit with feedback control of wafer thickness based on the scan data of a laser probe. Firstly, the mechanical structure, as well as the signal transmission and control of the DSP system, are discussed, in which the thickness feedback control is emphasized. Then, the precise positioning of the laser probe is explored to obtain the continuous and valid scan data of the wafer thickness. After that, a B-spline model is applied for the characterization of the wafer thickness function to provide the thickness control system with credible thickness deviation information. Finally, experiments of wafer-thickness evaluation and control are conducted on the presented DSP system. With the advisable number of control points in B-spline fitting, the thickness variation can be effectively controlled in wafer polishing with the DSP system, according to the experimental results of curve fitting and the statistical analysis of the experimental data.

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“…The wafer grinding process is the very first process in the whole fan-out wafer level packaging assembly process. The aim of wafer grinding process is to grind the incoming wafer to the required thickness for further processes [96][97][98][99][100][101][102][103][104].…”

Section: Effect Factors On Silicon Die Strengthmentioning

confidence: 99%

Advanced flip chip and wafer level packages for 2.5D and 3D IC package technology

Xu¹

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The demand of electronic product explodes in recent years, and the trend of electronic product is portable, multifunctional and budget currently. The fan-out wafer level packaging technology is a kind of wafer level packaging technology, and it becomes more and more attractive and popular because of its flexibility to integrate diverse devices in a very small form factor. The fan-out wafer level packaging technology has the advantages of high density of input/output, minimal package size and low cost. The fan-out wafer level package (FOWLP) is usually used to volume sensitive devices such as mobile phones and wearables. However, the strength of ultrathin FOWLP is low, and the low package strength often leads to crack issues. Therefore, the study of strength behavior of FOWLP is essential. FOWLP is made up of various materials and thus the proper structure design and material selection are important to meet the reliability requirement. The FOWLP strength is evaluated by the experimental method and numerical method. We confirm three significant characteristics of FOWLP strength from the experimental work. The wafer grinding process, FOWLP dimension and thermal factor affect the FOWLP strength significantly. The numerical work proves that the flexure strength of over-molded structure FOWLP is higher than the flexure strength of other structure FOWLPs with the same package thickness. Two theoretical models of FOWLP strength are proposed. These two models are based on the location of FOWLP initial fracture point. The comparison of FOWLP strength model with experiment results and simulation results shows that they are identical. A new theoretical model of FOWLP fatigue crack growth is proposed. This model additionally considers the effect of thermal factor on the FOWLP fatigue crack growth. ii ACKNOWLEDGMENT The author would like to express his gratitude to the people who have given their hands throughout the author's Ph.D. study journey. The author's thanks and appreciations also extend to: Associate Professor Zhong Zhaowei, the author's supervisor. He shows his generosity, encouragement and patience in guiding the author in various aspects during the Ph.D. study. He is also always trying to motivate and encourage the author to reach his goal. Dr. Choi Won Kyoung, the author's co-supervisor. She shows her attention, suggestion and guidance to the author. She also shares a lot of her knowledge and experience on the aspect of advanced packaging with the author. She is also always explaining the author's doubts throughout the project. Ms. Heng Chee Hoon, NTU biological laboratory assistant manager, Mr. Leong Kwok Phui, NTU materials laboratory manager and Ms. Yeong Peng Neo, NTU materials laboratory Executive. They show their generosity and patience in guiding and teaching the author to use the laboratory machines. They also provide the technical support to the author's experiment from hardware to software. Ms. Lee Koon Fong, mechatronics laboratory manager. She kindly and tremendously helps the author to purchase necess...

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A predictive model of grinding force in silicon wafer self-rotating grinding

Cited by 75 publications

References 35 publications

A novel high-shear and low-pressure grinding method using specially developed abrasive tools

A novel high-shear and low-pressure grinding method using specially developed abrasive tools

Laser-based Thickness Control in a Double-Side Polishing System for Silicon Wafers

Advanced flip chip and wafer level packages for 2.5D and 3D IC package technology

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