A Practical Implementation of Silicon Microchannel Coolers for High Power Chips

Colgan, E. G.; Furman, B. K.; Gaynes, Michael; Graham, William P.; LaBianca, N.; Magerlein, J. H.; Polastre, R.; Rothwell, Mary Beth; Bezama, R. J.; Choudhary, R.; Marston, K.; Toy, Hilton; Wakil, J.; Zitz, Jeffrey A.; Schmidt, Roger

doi:10.1109/tcapt.2007.897977

Cited by 192 publications

(38 citation statements)

References 6 publications

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“…Alternative solutions such as jet impingement cooling, single-phase and two-phase cooling in microchannels have been explored and showed different advantages or drawbacks (e.g. Agostini et al [2], Colgan et al [12] and Faulkner et al [15]). Among them, two-phase flow boiling in microchannels seems to be the most promising approach.…”

Section: Introductionmentioning

confidence: 99%

Critical heat flux in multi-microchannel copper elements with low pressure refrigerants

Park

Thome

2010

International Journal of Heat and Mass Transfer

106

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Section: Introductionmentioning

confidence: 99%

Critical heat flux in multi-microchannel copper elements with low pressure refrigerants

Park

Thome

2010

International Journal of Heat and Mass Transfer

106

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“…However, recent data obtained with enhanced single-phase flow and flow boiling in microchannels indicate that this may not be necessarily true with the current status of these two modes of heat transfer. Single-phase in enhanced microchannels, 48 µm×256 µm, offset strip fins, 500 µm, Colgan et al (2007), Steinke and Kandlikar (2006) > 500 5-10…”

Section: Introductionmentioning

confidence: 99%

“…However, the microchannels enhanced with short offset strip fins provide a very high heat transfer coefficient. In a practical system with this geometry, Colgan et al (2007) employed multiple inlet/outlet regions with a flow length of only 2 mm through the microchannels. This configuration holds the most promise in meeting the future chip cooling challenges.…”

Section: Introductionmentioning

confidence: 99%

Similarities and Differences Between Flow Boiling in Microchannels and Pool Boiling

Kandlikar

2010

Heat Transfer Engineering

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Recent literature indicates that under certain conditions the heat transfer coefficient during flow boiling in microchannels is quite similar to that under pool boiling conditions. This is rather unexpected as microchannels are believed to provide significant heat transfer enhancement under single-phase as well as flow boiling conditions. This paper explores the underlying heat transfer mechanisms and illustrates the similarities and differences between the two processes. Formation of elongated bubbles and their passage over the microchannel walls have similarities to the bubble ebullition cycle in pool boiling. During the passage of elongated bubbles, the longer duration between two successive liquid slugs leads to wall dryout and a critical heat flux that may be lower than that under pool boiling conditions. A clear understanding of the similarities and differences will help in overcoming some of these limiting factors and in developing strategies for enhancing heat transfer during flow boiling in microchannels.

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“…Because of close placement of chips on the silicon carrier, heat removal may become an issue for chips dissipating large amount of power. However, latest development in thermal interface materials and copper heat sinks coupled with micro-channel liquid cooling assure heat removal capability of greater than 300 W/cm 2 [3]. Additionally, chips that are assembled on the silicon carrier can be thinned down to the same thickness using well developed wafer thinning technologies [9].…”

Section: Eda Issuesmentioning

confidence: 99%

Silicon carrier for computer systems

Patel

2006

Proceedings of the 43rd Annual Conference on Design Automation - DAC '06

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System-on-Package (SOP) based on silicon carriers has the potential to provide modular design flexibility and high-performance integration of heterogeneous chip technologies for a wide range of two-and three-dimensional product applications. Key technology enablers include silicon through-vias, high-density wiring, high-I/O chip interconnection, and supporting test and assembly technologies. This paper describes the electrical characterization of key technical elements of the silicon carrier and discusses the significance of those elements in enhancing the overall system performance. The paper also discusses some methodologies that may allow silicon carrier technical elements to be easily integrated within existing EDA tools.

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A Practical Implementation of Silicon Microchannel Coolers for High Power Chips

Cited by 192 publications

References 6 publications

Critical heat flux in multi-microchannel copper elements with low pressure refrigerants

Critical heat flux in multi-microchannel copper elements with low pressure refrigerants

Similarities and Differences Between Flow Boiling in Microchannels and Pool Boiling

Silicon carrier for computer systems

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