A PoF approach to addressing defect-related reliability

Bauernschub, R.; Lall, Pradeep

doi:10.1109/iemt.1994.404694

Cited by 4 publications

(12 citation statements)

References 25 publications

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“…Bond pad contamination [16] is caused by wafer processing, plastic package outgassing or epoxy die attach outgassing, and bleedout. Contaminants accelerate failure by reducing the onset temperature or the time to failure due to intermetallic growth.…”

Section: Failure Modes Identified As a Bonding Defectmentioning

confidence: 99%

“…Bond pad cratering [16] is the result of microcracks formed in the silicon and oxide layers under the bond pads due to stresses introduced during the dynamic force of the gold ball at touch-down impact, the static force applied after touchdown, ultrasonic energy, mechanical vibrations before or after bonding, and the hardness of the gold ball. The effect of cratering is a reduction in the strength of the silicon oxide layers under the bond pads.…”

Section: Failure Modes Identified As a Bonding Defectmentioning

confidence: 99%

“…Bond resistance change [16] is essentially a poor contact at the bond surface that is caused by intermetallic growth, Kirkendall voiding, bond pad contamination, corrosion, intermetallic formation, and manufacturing errors. A bond is considered failed open when its resistance is increased by 20 milliohm from its original value.…”

Section: Failure Modes Identified As a Bonding Defectmentioning

confidence: 99%

“…Bondline thickness error [16] is caused by a lack of control in die alignment or the latent evaporation of die adhesive solvent that leads to either too much or too little die adhesive material. When the bondline thickness approaches the dimensions of the filler, reduced bonding strengths can result.…”

Section: Failure Modes Identified As a Bonding Defectmentioning

confidence: 99%

“…Incorrect bond placement [16] is attributed to poor process controls. The result of incorrectly placed bonds is short circuits or crossed wires.…”

Section: Failure Modes Identified As a Bonding Defectmentioning

confidence: 99%

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Failure Analysis in Subsystem Design for Space Missions

Uder

Stone

Tumer

2004

Volume 3a: 16th International Conference on Design Theory and Methodology

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We supplement previous efforts toward describing a standardized vocabulary for mechanical failures by presenting the current state of an electromechanical failure mode taxonomy. Failure is defined in terms of the cause of the failure mode, the failure mode, and the effect of the failure mode that renders an electrical, mechanical or electromechanical device incapable of satisfactorily performing its intended function under normal usage conditions. We utilize an elemental physics of failure approach to define failure mode and then use this definition and literature review to develop the electrical failure modes presented in the taxonomy. The list of proposed electrical failure modes is tested against a set of NASA problem reports before being revised to include additional failure modes encountered in space applications. The resulting taxonomy is summarized in the form of 38 electrical failure modes organized into 13 categories. The final version of the electromechanical failure mode taxonomy will be combined with a functional modeling approach to predict potential failures during the conceptual stages of design.

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Section: Failure Modes Identified As a Bonding Defectmentioning

confidence: 99%

Section: Failure Modes Identified As a Bonding Defectmentioning

confidence: 99%

Section: Failure Modes Identified As a Bonding Defectmentioning

confidence: 99%

Section: Failure Modes Identified As a Bonding Defectmentioning

confidence: 99%

“…Incorrect bond placement [16] is attributed to poor process controls. The result of incorrectly placed bonds is short circuits or crossed wires.…”

Section: Failure Modes Identified As a Bonding Defectmentioning

confidence: 99%