2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) 2023
DOI: 10.23919/vlsitechnologyandcir57934.2023.10185159
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A Pitch-Matched Transceiver ASIC for 3D Ultrasonography with Micro-Beamforming ADCs based on Passive Boxcar Integration and a Multi-Level Datalink

Abstract: This paper presents a pitch-matched transceiver ASIC integrated with a 2-D transducer array for a wearable ultrasound device for transfontanelle ultrasonography. The ASIC combines 8-fold multiplexing, 4-channel microbeamforming (μBF) and sub-array-level digitization to achieve a 128-fold channel-count reduction. The μBF is based on passive boxcar integration and interfaces with a 10-bit 40 MS/s SAR ADC in the charge domain, thus obviating the need for explicit anti-alias filtering and power-hungry ADC drivers.… Show more

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