2009 IEEE 6th International Power Electronics and Motion Control Conference 2009
DOI: 10.1109/ipemc.2009.5157486
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A PCB system integration concept for power electronics

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Cited by 8 publications
(3 citation statements)
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“…A number of failure mechanisms in these sub-components can be linked to temperature and therefore, methods that can improve thermal management of the converter can be beneficial for the overall reliability of the converter. The power sandwich integration is one such concept [68], [69] that uses new passive components that have equal heights and are sandwiched between two substrates allowing heat transfer in both directions.…”
Section: B Component Reliability -Converter Levelmentioning
confidence: 99%
“…A number of failure mechanisms in these sub-components can be linked to temperature and therefore, methods that can improve thermal management of the converter can be beneficial for the overall reliability of the converter. The power sandwich integration is one such concept [68], [69] that uses new passive components that have equal heights and are sandwiched between two substrates allowing heat transfer in both directions.…”
Section: B Component Reliability -Converter Levelmentioning
confidence: 99%
“…8(b). The core reluctances R m,easy and R m,hard , the window reluctance R m,σ , and the air gap reluctance R m,air are evaluated corresponding to (5). Solving the reluctance model as a function of l air results in the flux Φ i (l air ) through each winding package i.…”
Section: Transformer Design Proceduresmentioning
confidence: 99%
“…Power Sandwich proposed in [5] and [6] is a construction technology which allows for automated SMT manufacturing and high power densities of power electronic converters. New SMT x-dim components, introduced in [7], having the same (or compatible) heights, x, are stacked between planar substrates in an automated process (Fig.…”
Section: A the Power Sandwich -Concept Overviewmentioning
confidence: 99%