A paste based on Cu@Sn@Ag particles for die attachment under ambient atmosphere in power device packaging

Wang, Kang; Yu, Feng; Hang, Chunjin; Fu, Xing; Chen, Hongtao; Li, Mingyu

doi:10.1007/s10854-019-02697-9

Cited by 8 publications

(4 citation statements)

References 29 publications

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“…The shear strength of Cu@Sn samples reflowing at 280 °C for 40 min and aging at 400 °C for 1000 h are 48.9 and 44.6 MPa, respectively, which is higher than that of the similar system, for Cu@Sn@Ag system, 22 the average shear strengths of the bondline were 25.8 and 19.7 MPa at 30 and 400 °C, respectively. For Sn-coated Cu micro paste system, 23 the TLPS-bonded joints exhibit relatively high shear strength values of ∼40 MPa.…”

Section: Resultsmentioning

confidence: 79%

Fabrication of Cu@Sn TLPS joint for high temperature power electronics application

Zhang

et al. 2022

RSC Adv.

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Section: Resultsmentioning

confidence: 79%

Fabrication of Cu@Sn TLPS joint for high temperature power electronics application

Zhang

et al. 2022

RSC Adv.

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Section: Low-temperature-cured Silver-coated Copper Pastementioning

confidence: 99%

“…4c). To address the transient liquid phase bonding of low-temperature pastes, Liu et al [57] proposed a Cu@Sn@Ag sandwich structure, whose schematic diagram is shown in Fig. 4d.…”

Section: Low-temperature-cured Silver-coated Copper Pastementioning

confidence: 99%

Review on Metallization Approaches for High-Efficiency Silicon Heterojunction Solar Cells

Zeng

Peng

Wang

et al. 2022

Trans. Tianjin Univ.

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Crystalline silicon (c-Si) heterojunction (HJT) solar cells are one of the promising technologies for next-generation industrial high-efficiency silicon solar cells, and many efforts in transferring this technology to high-volume manufacturing in the photovoltaic (PV) industry are currently ongoing. Metallization is of vital importance to the PV performance and long-term reliability of HJT solar cells. In this review, we summarize the development status of metallization approaches for high-efficiency HJT solar cells. For conventional screen printing technology, to avoid the degradation of the passivation properties of the amorphous silicon layer, a low-temperature-cured (< 250 ℃) paste and process are needed. This process, in turn, leads to high line/contact resistances and high paste costs. To improve the conductivity of electrodes and reduce the metallization cost, multi-busbar, fine-line printing, and low-temperature-cured silver-coated copper pastes have been developed. In addition, several potential metallization technologies for HJT solar cells, such as the Smart Wire Contacting Technology, pattern transfer printing, inkjet/FlexTrailprinting, and copper electroplating, are discussed in detail. Based on the summary, the potential and challenges of these metallization technologies for HJT solar cells are analyzed.

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“…Xu et al 33 prepared Cu@Ag composite powders with Ni intermediate layers, which have excellent electrical conductivity and high-temperature oxidation resistance. Liu et al 34 prepared a composite bond layer based on slurry of silvercoated copper powders with Sn interlayer core-shell particles, which shows high-temperature resistance. Mao et al 35 prepared high-temperature resistant prefabricated rods based on silver-coated copper powders with In interlayer using chemical plating method, which shows hightemperature resistance performance.…”

Section: Introductionmentioning

confidence: 99%

Preparation and anti-oxidisation resistance of silver-coated copper powders by cobalt-modified copper powders

Han,

Cao,

Lin

et al. 2024

Materials Science and Technology

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Spherical copper powders and cobalt-modified copper powders were electroless plated with silver, respectively, to obtain two kinds of silver-plated copper powders. The composite powders were analysed by X-ray diffraction, X-ray photoelectron spectroscopy, scanning electron microscopy and thermogravimetric-differential scanning calorimetry. Effects of cobalt modification on surface morphology, silver reduction rate, particle size and anti-oxidisation resistance of composite powders were studied. The results indicate that surface morphology of silver-coated copper powders prepared by cobalt-modified copper powders was affected by cobalt, but the size, mass and the percent reduction of silver were significantly increased under the same conditions of electroless plating silver. And silver-coated copper powders prepared by cobalt-modified copper powders have better anti-oxidisation resistance than silver-coated copper powders prepared by copper powders.

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A paste based on Cu@Sn@Ag particles for die attachment under ambient atmosphere in power device packaging

Cited by 8 publications

References 29 publications

Fabrication of Cu@Sn TLPS joint for high temperature power electronics application

Fabrication of Cu@Sn TLPS joint for high temperature power electronics application

Review on Metallization Approaches for High-Efficiency Silicon Heterojunction Solar Cells

Preparation and anti-oxidisation resistance of silver-coated copper powders by cobalt-modified copper powders

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