A parametric study of phase change material (PCM)-based heat sinks

Wang, Xiangqi; Yap, Cheng‐Hon; Mujumdar, Arun S.

doi:10.1016/j.ijthermalsci.2007.07.016

Cited by 107 publications

(39 citation statements)

References 32 publications

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“…1 According to the analysis of Shatikian et al [9] and wang [13], the PCM-based heat sink which is used in cooling of electronic components is relatively small. It is expected that heat sink which is embedded with PCM is superior to that of the conventional one.…”

Section: The Physical Problem Descriptionmentioning

confidence: 99%

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Constructal design of horizontal fins to improve the performance of phase change material rectangular enclosures

Kalbasi

Salimpour

2015

Applied Thermal Engineering

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Section: The Physical Problem Descriptionmentioning

confidence: 99%

“…In 2008, experiments done by Kandasamy et al[12] revealed that the performance of a PCM-based heat sink is better than the heat sink without PCM. Wang et al[13] demonstrated that the variation of melting time has no linear function with PCM volume. In other words, when the value of ౌి is doubled or tripled, the melting time is less than two or three-fold.…”

mentioning

confidence: 99%

Constructal design of horizontal fins to improve the performance of phase change material rectangular enclosures

Kalbasi

Salimpour

2015

Applied Thermal Engineering

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“…However, one primary drawback of these PCMs is their low thermal conductivities. To increase the effective thermal conductivities, several thermal conductivity enhancers (TCE) such as fin or partition [205][206][207][208][209], packed particles [210], micro-or macro-encapsulation [211,212], and metal [213] or graphite foams [214] are used. Of these various PCM/TCE approaches, PCM/foam systems show great potential for use in TES devices particularly those requiring fast thermal transient response [112].…”

Section: Numerical Modeling Of Heat Transfer In Open-cell Micro-fam Wmentioning

confidence: 99%

Multiscale Modeling of Multiphase Fluid Flow

Patnaik¹,

Iskrenova-Ekiert²,

Wan³

2016

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“…LHS has been widely applied in building materials, [3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18] free cooling, [19][20][21][22] electronics cooling, [23][24][25][26][27][28][29][30][31][32][33][34] solar water heating, [35][36][37][38][39][40][41][42] solar power generation, [43][44][45][46][47][48][49] and waste heat utilization. [50][51][52][53][54]…”

Section: Technology Of Latent Heat Storage For High Temperature Applimentioning

confidence: 99%

Technology of Latent Heat Storage for High Temperature Application: A Review

2010

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Table 2. Thermophysical properties of proposed PCM candidates-sugar alcohol, molten salt, and metallicwith phase-changing point over 100°C.from steelworks 2) has more enthalpy at lower temperature but more exergy at a higher temperature over 100°C. Table 3 lists frequently selected keywords from the collected papers. Papers on LHS and PCM frequently used general keywords such as "phase-change material", "PCM", "thermal energy storage", and "latent heat". Apart from these, interestingly, "solar energy" was also frequently used; these papers dealt with PCMs that can store solar energy through melting for various utilities. Keywords such as "phase-change composites", "thermal conductivity", "shape-stabilized" should be noteworthy in that these are related to general problems encountered during the use of PCMs, that is, capsulation and low thermal conductivity. Recent Advancements in LHS Technology PCM CapsulesGenerally, because LHS mainly utilizes the phase change between solid and liquid, the encapsulation of the PCM is necessary to avoid the leakage of a liquid PCM. In addition, Regin et al. 70) noted the functions and requirements of PCM containment: (i) meeting the requirements of strength, flexibility, corrosion resistance, and thermal stability; (ii) acting as a barrier to protect the PCM from harmful interactions with the environment; (iii) providing a sufficient surface for heat transfer, and (iv) providing structural stability and easy handling. PCM capsules are classified into macroand microcapsules.Macrocapsules are the most conventional PCM capsules, and many papers have reported various shell materials such as metal and plastics, and various shapes such as spherical [71][72][73][74][75] and cylindrical. 72,[76][77][78] In contrast, micro-encapsulation of PCM has recently attracted considerable attention [79][80][81][82][83][84][85] because it reduces the reactivity of the PCMs with the outside environment, increases the heat transfer area of the PCMs, and enables the core material to withstand frequent changes in the volume of the storage material during phase change. Table 4 lists trends in manufacturing methods for PCM capsules. Many papers have reported the production of various microcapsules, and the manufacturing methods, core PCM materials, shell materials, thermophysical properties, and capsule sizes of the same have been studied. Micro-interfacial polymerization, 80) in-situ polycondensation, [81][82][83][84][85] and complex coacervation 79) are the most popular microen- ISIJ International, Vol. 50 (2010), No. 9 79,80) 1232© 2010 ISIJ proposed the encapsulation of spherical metal PCMs such as Cu and Pb with an electroplated Ni layer to recover industrial hightemperature waste heat such as combustion offgas. The PCM spherical capsule with Ni coverage provided hybrid functions of both heat storage and catalysis. Nickel worked well as a catalyst of the gas phase reaction CH 4 ϩH 2 Oϭ 3H 2 ϩCO at 1000°C.In summary, the encapsulation of low-temperature PCMs is a state-of-the-art technology; in p...

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A parametric study of phase change material (PCM)-based heat sinks

Cited by 107 publications

References 32 publications

Constructal design of horizontal fins to improve the performance of phase change material rectangular enclosures

Constructal design of horizontal fins to improve the performance of phase change material rectangular enclosures

Multiscale Modeling of Multiphase Fluid Flow

Technology of Latent Heat Storage for High Temperature Application: A Review

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