A parametric study of a typical high power LED package to enhance overall thermal performance

high power LED heat dissipation simulation analysis via heat sink fin variation

“…The overall reduction in terms of junction temperature, von Mises stress and thermal resistance is due to the increase of the overall surface area of the heat sink [10]. The surface area plays an important role in the heat dissiaption of the LED [1,2,5]. With the increment of heat sink fins, the surface area of the heat sink also increases.…”

“…Revolution to the lighting industry, the high power light emitting diodes (LEDs) is the latest lighting technology utilized due to its vast advantage in terms of luminous efficiency, power saving and long operating life over the conventional lighting technology [1].Nevertheless, this revolution had created substantial amount of thermal management challenges as the heat created by the chip requires sufficient dissipation to limit the degradation in performance, reliability, efficiency and failure of the high power LED package [2]. Various works have been done to address the heat dissipation issue faced by the high power LEDs.…”

LED Heat Dissipation Analysis Using Composite Based Cylindrical Slug

“…A high operating junction temperature will lead to optical deterioration which will directly reduce the life time of the LED [3]. Vipradas et al [4] performed thermal analysis on LED model to evaluate and minimize the junction temperature of the LED by studying the effects of die size, thickness of adhesive and dimension of lead frame on the LED heat dissipation. Zhang et al [5] scrutinized the thermal atributes of an innovation mutlichip vertical packaged (MCVP) LED by combination of temperature sensitive parameter to evalute the opreating temperature of the LED with varied substartes.Ye, Koh, Wei, van Zeijl and Zhang [6] reported a dynamic thermal simulation of high power light emitting diode with vacillating driver power output.…”

Experimental, Numerical and Analytical Investigation of Thermal Resistance in High Brightness LED Arrays

“…The LED package consists of die, die attach, heat conducting slug enclosed in a ceramic package, thermal slug pad, encapsulation and lens. Electrical connections are established through the lead frames to the copper layers but are not shown here because their thermal contribution is negligible [5]. The PCB shown here is a metal core type (MC PCB) and consists of a dielectric insulator layer on top of the anodized aluminum [6].…”