2011
DOI: 10.1016/j.ijheatmasstransfer.2010.09.057
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A numerical model for transport in flat heat pipes considering wick microstructure effects

Abstract: a b s t r a c tA transient, three-dimensional model for thermal transport in heat pipes and vapor chambers is developed. The Navier-Stokes equations along with the energy equation are solved numerically for the liquid and vapor flows. A porous medium formulation is used for the wick region. Evaporation and condensation at the liquid-vapor interface are modeled using kinetic theory. The influence of the wick microstructure on evaporation and condensation mass fluxes at the liquid-vapor interface is accounted fo… Show more

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Cited by 119 publications
(54 citation statements)
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“…This interface shape dictates the thickness of an extended thin-liquid film formed within the wick pores, and determines the local evaporation/condensation heat transfer characteristics. To capture these effects, Ranjan et al [160] developed a numerical approach wherein a macroscale device-level model was coupled with a sub-device microscale model that predicted meniscus shape and evaporation from a representative unit cell structure.…”
Section: Wick Microstructure Effects On Evaporation Characteristicsmentioning
confidence: 99%
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“…This interface shape dictates the thickness of an extended thin-liquid film formed within the wick pores, and determines the local evaporation/condensation heat transfer characteristics. To capture these effects, Ranjan et al [160] developed a numerical approach wherein a macroscale device-level model was coupled with a sub-device microscale model that predicted meniscus shape and evaporation from a representative unit cell structure.…”
Section: Wick Microstructure Effects On Evaporation Characteristicsmentioning
confidence: 99%
“…The device-level model used by Ranjan et al [160] was an adapted version of the flat heat pipe model originally developed by Vadakkan et al [109]. The mass, momentum, and energy equations are solved in the solid, porous, and vapor domains to determine the temperature and pressure fields within the device.…”
Section: Wick Microstructure Effects On Evaporation Characteristicsmentioning
confidence: 99%
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“…The 2D geometry and case details ( Figure 2) are taken from Ref. [20]. The external dimensions are 30 mm × 3 mm, with a uniform copper wall thickness of 0.25 mm and a uniform wick thickness of 0.2 mm; the wick has porosity, permeability, and effective conductivity of 0.56, 2.97×10 -11 m 2 , and 40 W/mK, respectively.…”
Section: Steady-state-seeking Solution Algorithmmentioning
confidence: 99%