A novel structure to realize crack-free plastic package during reflow soldering process-development of Chip Side-Support (CSS) package

Nakazawa, T.; Inoue, Y.; Sawada, K.; Sudô, Toshio

doi:10.1109/3476.484206

Cited by 5 publications

(1 citation statement)

References 6 publications

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“…The approach followed by one group was to focus on a redesign of the package to eliminate the die attach adhesive, but maintain the moulding compound. The chip side-support (CSS) package was found to be crack free after exposure to humidity, followed by solder reflow temperatures [2]. A package re-design is not always an available option, and so efforts have been directed toward an understanding of the material properties that lead to this susceptibility to poor package reliability.…”

Section: Introductionmentioning

confidence: 99%

Chemistries for High Reliability in Electronics Assemblies

Herr¹,

Nikolic

Schultz

2001

High Performance Polymers

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This article provides a review of the attitude of the scientific community towards reliability in electronic packages, with emphasis on the prevailing mechanisms for package failure under highly stressed environmental conditioning. Once this failure mechanism is fully developed, approaches to the resolution can be more rigorously applied. Overall, the predominant evidence points to moisture, both diffusivity and equilibrium weight gain, as the key factor in reduced reliability performance. Other fundamental polymer properties are important, but generally, methods are well established for adjusting these parameters. Moisture uptake is somewhat inherent to a particular chemistry type and this can direct the use of resin systems that are more suited to particularly moist environments. Epoxy resin systems, while pervasive in the electronics industry, do have limitations under humid environmental test conditions. Cyanate ester resin chemistry is claimed to have low moisture uptake by virtue of a nonhydrophilic cure mechanism. However, certain aspects of the cure chemistry and side reactions with water can result in misleading predictions on humid environment performance. Siloxane-based materials present an attractive solution to many moisture related issues. Traditional condensation and addition cure silicone systems have, thus, found widespread use as packaging adhesives and encapsulants. Siloxane-functional polyimides have also been successfully utilized in a number of application areas. Relatively new siloxane/hydrocarbon resins, developed specifically for electronics applications, further address the shortcomings of classic silicone adhesives and coatings.

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Section: Introductionmentioning

confidence: 99%

Chemistries for High Reliability in Electronics Assemblies

Herr¹,

Nikolic

Schultz

2001

High Performance Polymers

View full text Add to dashboard Cite

show abstract

Reliability of new packaging concepts

Sinnadurai¹

2000

Microelectronics Reliability

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A synthetic criterion for level-1 crack-free package-proposal of a superior package structure

Inoue

Sawada

Kawamura

et al.

1996 Proceedings 46th Electronic Components and Technology Conference

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A synthetic criterion to provide guidance for the high-reliability structure design for the level-1 crackfree package is introduced. The criterion reflects a consideration of both delamination and package cracking. According to the criterion, to prevent delamination is the most effective means to realize the level-1 crack-free package for large chips (ex.15" square). Therefore, a new package structure, a chip side support (CSS) structure which eliminates a die-pad is proposed and reliability tests are carried out. The CSS package realizes the level-1 crack-free package without moisture-proof packing.

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A novel structure to realize crack-free plastic package during reflow soldering process-development of Chip Side-Support (CSS) package

Cited by 5 publications

References 6 publications

Chemistries for High Reliability in Electronics Assemblies

Chemistries for High Reliability in Electronics Assemblies

Reliability of new packaging concepts

A synthetic criterion for level-1 crack-free package-proposal of a superior package structure

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