2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2023
DOI: 10.1109/itherm55368.2023.10177547
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A Novel Scalable Modular Immersion Cooling System Architecture for Sustainable Data Center

Carrie Chen
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Jiahong Wu
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Jun Zhang
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et al.
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Cited by 6 publications
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Hydrogen as power storage technology, polymeric and interconnect material innovations for future AI datacenter applications: a review

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Hydrogen as power storage technology, polymeric and interconnect material innovations for future AI datacenter applications: a review

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J Mater Sci: Mater Electron
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Dk and Df Characterization of Low-loss Dielectric Liquid by Cylindrical Cavity Resonator

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