A novel packaging technology for miniaturization of active long-term implantable medical devices enabling new medical applications

James, Rony Jose; Gobet, J.; Durante, G. Spinola; Fretz, Mark

doi:10.1109/estc.2016.7764495

Cited by 2 publications

(1 citation statement)

References 13 publications

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“…Due to the saline environment of the tissue, galvanic corrosion between exposed metals can occur both in dissimilar metals and between identical metals in different environments (crevice corrosion) [32,33]. Corrosion can also be exacerbated by electrical stimulation due to electrolysis, which reduces the pH around the implant [34,35].…”

Section: New and Existing Challenges In Clinical Neural Implant Packa...mentioning

confidence: 99%

Ceramic packaging in neural implants

Shen

Maharbiz

2021

J. Neural Eng.

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The lifetime of neural implants is strongly dependent on packaging due to the aqueous and biochemically aggressive nature of the body. Over the last decade, there has been a drive towards neuromodulatory implants which are wireless and approaching millimeter-scales with increasing electrode count. A so-far unrealized goal for these new types of devices is an in-vivo lifetime comparable to a sizable fraction of a healthy patient’s lifetime (>10–20 years). Existing, approved medical implants commonly encapsulate components in metal enclosures (e.g. titanium) with brazed ceramic inserts for electrode feedthrough. It is unclear how amenable the traditional approach is to the simultaneous goals of miniaturization, increased channel count, and wireless communication. Ceramic materials have also played a significant role in traditional medical implants due to their dielectric properties, corrosion resistance, biocompatibility, and high strength, but are not as commonly used for housing materials due to their brittleness and the difficulty they present in creating complex housing geometries. However, thin-film technology has opened new opportunities for ceramics processing. Thin films derived largely from the semiconductor industry can be deposited and patterned in new ways, have conductivities which can be altered during manufacturing to provide conductors as well as insulators, and can be used to fabricate flexible substrates. In this review, we give an overview of packaging for neural implants, with an emphasis on how ceramic materials have been utilized in medical device packaging, as well as how ceramic thin-film micromachining and processing may be further developed to create truly reliable, miniaturized, neural implants.

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Section: New and Existing Challenges In Clinical Neural Implant Packa...mentioning

confidence: 99%

Ceramic packaging in neural implants

Shen

Maharbiz

2021

J. Neural Eng.

View full text Add to dashboard Cite

show abstract

Ceramic Packaging in Neural Implants

Shen

Maharbiz

2020

Preprint

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AbstractThe lifetime of neural implants is strongly dependent on packaging due to the aqueous and biochemically aggressive nature of the body. Over the last decade, there has been a drive towards neuromodulatory implants which are wireless and approaching millimeter-scales with increasing electrode count. A so-far unrealized goal for these new types of devices is an in-vivo lifetime comparable to a sizable fraction of a healthy patient’s lifetime (>10-20 years). Existing, approved medical implants commonly encapsulate components in metal enclosures (e.g. titanium) with brazed ceramic inserts for electrode feedthrough. It is unclear how amenable the traditional approach is to the simultaneous goals of miniaturization, increased channel count, and wireless communication. Ceramic materials have also played a significant role in traditional medical implants due to their dielectric properties, corrosion resistance, biocompatibility, and high strength, but are not as commonly used for housing materials due to their brittleness and the difficulty they present in creating complex housing geometries. However, thin film technology has opened new opportunities for ceramics processing. Thin films derived largely from the semiconductor industry can be deposited and patterned in new ways, have conductivities which can be altered during manufacturing to provide conductors as well as insulators, and can be used to fabricate flexible substrates. In this review, we give an overview of packaging for neural implants, with an emphasis on how ceramic materials have been utilized in medical device packaging, as well as how ceramic thin film micromachining and processing may be further developed to create truly reliable, miniaturized, neural implants

show abstract

A novel packaging technology for miniaturization of active long-term implantable medical devices enabling new medical applications

Cited by 2 publications

References 13 publications

Ceramic packaging in neural implants

Ceramic packaging in neural implants

Ceramic Packaging in Neural Implants

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