A Novel Multi-Scale Feature Learning-Based Residual Network Improves Semiconductor Wafer Defect Classification Accuracy

Ma, Can; Yao, Yiming; Jie, Luyang; Hu, Lilei

doi:10.1109/iwaps60466.2023.10366060

2023 International Workshop on Advanced Patterning Solutions (IWAPS) 2023

DOI: 10.1109/iwaps60466.2023.10366060

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A Novel Multi-Scale Feature Learning-Based Residual Network Improves Semiconductor Wafer Defect Classification Accuracy

Can Ma,

Yiming Yao,

Luyang Jie

et al.

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A Novel Multi-Scale Feature Learning-Based Residual Network Improves Semiconductor Wafer Defect Classification Accuracy

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References 14 publications

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