A novel method for packaging of micromachined piezoresistive pressure sensor

A novel plastic package for pressure sensors fabricated using the lithographic dam-ring approach

“…A variety of packaging techniques for pressure sensor application have been proposed in recent years. In [2][3][4], the pressure sensors were packaged using a two-step process in which a pre-mold plastic host was embedded within a lead frame substrate. However, low throughput and a large packaging volume are not suitable for portable commercial products.…”