A novel method for evaluating triaxial strain gages used in printed circuit board assemblies (PCBA) strain monitoring

Shi, Hang; Ikezawa, Satoshi; Ueda, T.

doi:10.1109/icsens.2011.6127326

Cited by 5 publications

(2 citation statements)

References 16 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Appropriately selected locations adhered with a strain gauge are very important for accurately measuring the strains on packages [4]. A method for evaluating the strain gauges used in printed circuit board assemblies was proposed for mechanical strain monitoring [5]. Mechanical-strain gauge data measuring on a package and a PCB under a 4-point bending test has been used for the finite element model's verification [6].…”

Section: Introductionmentioning

confidence: 99%

Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges

et al. 2017

View full text Add to dashboard Cite

Abstract:Measurements of the curvatures and warpages of a printed circuit board (PCB) during a thermal solder reflow process using strain gauges are proposed in this study. In the experiments, a shadow moiré is used for measuring the out-of-plane deformations (or warpage) of a bi-material plate and a PCB with dual in-line memory module (DIMM) sockets during solder reflow heating, while the finite element method (FEM) is used to analyze the thermally-induced deformation of the PCB specimen for ensuring the validity of the measurement. Conventional strain gauges are employed to measure the strains (albeit as in-plane strain data) in both specimens during the solder reflow process. The results indicate that the strain gauge-measured strain data from the top and bottom surfaces of both specimens during the solder reflow can be converted into curvature data with specific equations, and even into global out-of-plane deformations or warpages with a proposed simple beam model. Such results are also consistent with those from the shadow moiré and FEM. Therefore, it has been proved that the strain gauge measurement associated with the simple beam model can provide a method for the real-time monitoring of PCB deformations or warpages with different temperatures during the solder reflow process.

show abstract

Section: Introductionmentioning

confidence: 99%

Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges

et al. 2017

View full text Add to dashboard Cite

show abstract

“…Therefore, the strain gauge-based transducers are the best option for both high-scale industrial processes and more simple tasks, especially when it comes to high precision measurements. These features truly justify the widespread use of this kind of sensor in fields ranging from the healthcare sector [ 9 , 10 , 11 ] to the industrial sector [ 12 , 13 , 14 , 15 ] and civil engineering [ 16 ], among others.…”

Section: Introductionmentioning

confidence: 99%

Design of a Sensor System for On-Line Monitoring of Contact Pressure in Chalcographic Printing

Jiménez

Meca

Santiso

et al. 2017

Sensors

View full text Add to dashboard Cite

Chalcographic printer is the name given to a specific type of press which is used to transfer the printing of a metal-based engraved plate onto paper. The printing system consists of two rollers for pressing and carrying a metal plate onto which an engraved inked plate is placed. When the driving mechanism is operated, the pressure exerted by the rollers, also called contact pressure, allows the engraved image to be transferred into paper, thereby obtaining the final image. With the aim of ensuring the quality of the result, in terms of good and even transfer of ink, the contact pressure must be uniform. Nowadays, the strategies utilized to measure the pressure are implemented off-line, i.e., when the press machines are shut down for maintenance, which poses limitations. This paper proposes a novel sensor system aimed at monitoring the pressure exerted by the rollers on the engraved plate while chalcographic printer is operating, i.e., on-line. The purpose is two-fold: firstly, real-time monitoring reduces the number of breakdown repairs required, reduces machine downtime and reduces the number of low-quality engravings, which increases productivity and revenues; and secondly, the on-line monitoring and register of the process parameters allows the printing process to be reproducible even with changes in the environmental conditions or other factors such as the wear of the parts that constitute the mechanical system and a change in the dimensions of the printing materials. The proposed system consists of a strain gauge-based load cell and conditioning electronics to sense and treat the signals.

show abstract

Mechanical Simulation and Characterization of Flexural Fracture of Stacked Die Memory Package

Liu,

Yang,

et al. 2024

2024 25th International Conference on Electronic Packaging Technology (ICEPT)

View full text Add to dashboard Cite

A novel method for evaluating triaxial strain gages used in printed circuit board assemblies (PCBA) strain monitoring

Cited by 5 publications

References 16 publications

Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges

Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges

Design of a Sensor System for On-Line Monitoring of Contact Pressure in Chalcographic Printing

Mechanical Simulation and Characterization of Flexural Fracture of Stacked Die Memory Package

Contact Info

Product

Resources

About