A novel method for determination of the subsurface damage depth in diamond turning of brittle materials

Yu, Deping; Wong, Yoke San; Gao, Hong

doi:10.1016/j.ijmachtools.2011.08.007

Cited by 40 publications

(17 citation statements)

References 28 publications

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“…The amorphous layer thickness and dislocation density are very much depended on DoC and tool rake angle because they attribute the high compressive stress [53]. A subsurface damage analysis method was developed to determine the subsurface damage layer thickness by analyzing the surface damaged region with sinusoidal wave along radial direction [54].…”

Section: Subsurface Damagementioning

confidence: 99%

A review on ductile mode cutting of brittle materials

2018

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Brittle materials have been widely employed for industrial applications due to their excellent mechanical, optical, physical and chemical properties. But obtaining smooth and damage-free surface on brittle materials by traditional machining methods like grinding, lapping and polishing is very costly and extremely time consuming. Ductile mode cutting is a very promising way to achieve high quality and crack-free surfaces of brittle materials. Thus the study of ductile mode cutting of brittle materials has been attracting more and more efforts. This paper provides an overview of ductile mode cutting of brittle materials including ductile nature and plasticity of brittle materials, cutting mechanism, cutting characteristics, molecular dynamic simulation, critical undeformed chip thickness, brittle-ductile transition, subsurface damage, as well as a detailed discussion of ductile mode cutting enhancement. It is believed that ductile mode cutting of brittle materials could be achieved when both crack-free and no subsurface damage are obtained simultaneously.

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Section: Subsurface Damagementioning

confidence: 99%

A review on ductile mode cutting of brittle materials

2018

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“…where x M1i , y M1i , x N1i and y N1i could be calculated by Eqs. (11)- (16). Experiments have indicated that the cutting may be partial ductile mode cutting when feed f = 0.5 µm/rev under tool 22192 or 24557.…”

Section: Removal Characteristics Of Cracks In Shoulder Regionmentioning

confidence: 99%

“…But these models could be only used to calculate the median crack depth at the brittle-ductile transition position. Yu et al [16] presented a damaged region analysis method to determine the subsurface damage depth in fast tool servo diamond turning process, but the method was preferable to the micro-structured surface with sinusoidal wave along radial direction. Therefore, effective method for evaluating the surface and subsurface damages in the brittle material processed by SPDT is still worthy of study.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of surface and subsurface damages for diamond turning of ZnSe crystal

et al. 2019

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With single-point diamond turning (SPDT), a series of samples are processed under different cutting parameters. The brittle-ductile transition depth of ZnSe crystal is obtained, and the damages of the samples are measured from surface and subsurface damage depths as well as damage density. The effects of cutting parameters on the damages are investigated quantitatively. The results show the cutting depth has a minor while the feed has a major effects on the damages. Also, the interaction effect between feed and cutting depth is very small for surface damage depth or damage density, while it is large for subsurface damage depth. Based on the indentation mechanics and the kinetic characteristics of SPDT, a model is proposed to evaluate the surface and subsurface damage depths of ZnSe crystal by cutting parameters. The model has an average relative error less than 15.0%, which could be further used to obtain the depth and the removal characteristics of cracks in shoulder region.

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“…Due to the complexity of the micro-structure surfaces, the surface curvature radius R′ as well as Δφ i may change continuously, and a number of calculate results may be obtained while solving formula (12) directly. This phenomenon will bring troubles to the calculation process.…”

Section: The Principle Of New Toolpath Calculationmentioning

confidence: 99%

“…Reference points are first chosen in the xoy plane with equal central angle interval, and then projected onto the given micro-structured surfaces to obtain the tool contact points (TCPs), accordingly determining the tool location points (TLPs) [12][13][14].…”

Section: Introductionmentioning

confidence: 99%

Determining issues in optimal turning of micro-structured functional surfaces

Zhang

Liu

Zhou

et al. 2015

Int J Adv Manuf Technol

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Micro-structured surfaces have received everincreasing requirements in various fields, including optical systems, biological engineering, measurement system, and so on. Fast tool servo (FTS)-assisted ultra-precision diamond turning technique has been extensively regarded to be a very promising technology for the fabrication of the microstructured functional surfaces with high efficiency and high surface quality. In this paper, the machining flowchart is thoroughly introduced; the key cutting parameters including tool geometry, diamond turning machine (DTM) slide carriage feedrate, and spindle speed are carefully investigated and determined to obtain optimal cutting performances during machining processes. Additionally, a novel toolpath generation method is proposed to minimize the volume of the toolpath data. Comparing with current method, the data volume generated by the new method can be significantly decreased by several times. Finally, the efficiency of the proposed cutting parameter determination method and the new toolpath generation method are verified by fabricating a typical sinusoidal grid surface.

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A novel method for determination of the subsurface damage depth in diamond turning of brittle materials

Cited by 40 publications

References 28 publications

A review on ductile mode cutting of brittle materials

A review on ductile mode cutting of brittle materials

Evaluation of surface and subsurface damages for diamond turning of ZnSe crystal

Determining issues in optimal turning of micro-structured functional surfaces

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