A novel method combining laser ablation and chemical etch to expose packaged silicon backside for electrical fault isolation

Ting, Seng Kiong; Tan, Puay Siew; Moon, SeungJe; Alag, J. C.; Pan, Yutao; Hnin, Hnin; Kang, Kevin; Quah, A.C.T.; Chen, Chang

doi:10.1109/ipfa55383.2022.9915784

2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2022

DOI: 10.1109/ipfa55383.2022.9915784

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A novel method combining laser ablation and chemical etch to expose packaged silicon backside for electrical fault isolation

Seng Kiong Ting

Puay Siew Tan

SeungJe Moon

et al.

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A novel method combining laser ablation and chemical etch to expose packaged silicon backside for electrical fault isolation

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