A novel low-pass filter based on dielectric impedance inverters to enhance the multipactor breakdown threshold

On the Development of New Tuning and Inter-Coupling Techniques Using Ferroelectric Materials in the Detection of Dark Matter Axions

“…The coupling between cavities can be obtained by inductive or capacitive irises (see Fig. 1), which also determines the sign of the coupling [19], [23]. Thus, the size of the irises controls the amount of coupling between adjacent cavities.…”

Microwave Corona Breakdown Suppression of Microstrip Coupled-Line Filter Using Lacquer Coating

“…Like another power handling problem, multipactor, one of the most important aspects of corona research is how to suppress corona effect. Due to the similarity between multipactor and corona, they sometimes can be suppressed by using similar techniques such as electrical structure design/optimization [11,12], dielectric filling [13,14] as well as surface treatments [15]. For example, measurement results in [11] show that by introducing rounded-end resonators, hairpin microstrip bandpass filter's corona threshold can be improved by 2.1 dB.…”

Metallization of Polyamide-imide for High-Frequency Communication by Polyethylenimine Modification and Electroless Copper Plating

“…With the rapid progression of 5G communication technology, information processing has progressively advanced into the domain of high-frequency communication electronics and high-speed data transmission. − As the foundation of high-frequency communication, dielectric filters have garnered increasing attention toward cost-effective and range-massive communication electronics in the past few years. , Among the various types of dielectric filter substrates, polyamide-imide (PAI) substrates have been widely utilized in fields including radar reconnaissance, field communication, and communication base station, with advantages of smaller volume, lighter weight, better temperature adaptability, etc. − Up to now, various techniques such as burning infiltration silver, sputtering, and coating have been extensively investigated for the fabrication of conductive layers on PAI substrates. − Nevertheless, the high-temperature aging process of silver paste is time-consuming and energy-intensive. Meanwhile, the conventional sputtering process necessitates high-vacuum and voltage, which results in significant energy consumption. − Furthermore, the metallized PAI substrate prepared through coating typically results in a thick layer of copper, which cannot meet the requirements for ultrathin layers. − To achieve the metallization of substrates with superior adhesion, prospective metal thickness, and optimal cost-effectiveness, extensive research has been conducted on the process of electroless copper plating (ECP) onto the modified substrate surface. − As a well-established autocatalytic technique, electroless deposition is extensively utilized for the production of high-adhesion and low-resistivity metal layers on various types of materials, including polymer plastics, − papers, , ceramics, − and glasses. − Nevertheless, achieving strong adhesion between autocatalytic sites and smooth surfaces of PAI substrates without combinative functional groups or mechanical bonding points is full of challenges. −…”

“…1−4 As the foundation of highfrequency communication, dielectric filters have garnered increasing attention toward cost-effective and range-massive communication electronics in the past few years. 5,6 Among the various types of dielectric filter substrates, polyamide-imide (PAI) substrates have been widely utilized in fields including radar reconnaissance, field communication, and communication base station, with advantages of smaller volume, lighter weight, better temperature adaptability, etc. 7−12 Up to now, various techniques such as burning infiltration silver, sputtering, and coating have been extensively investigated for the fabrication of conductive layers on PAI substrates.…”