A novel insight into Au-Au thermosonic flip chip joint under extreme thermal cycles: Defect characterization and failure analysis

Liu, Jinhong; Hua, Yaling; Liu, Junfu; Paik, Kyung-Wook; He, Peng; Zhang, Shuye

doi:10.1016/j.surfin.2023.103771

Surfaces and Interfaces

2024

DOI: 10.1016/j.surfin.2023.103771

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A novel insight into Au-Au thermosonic flip chip joint under extreme thermal cycles: Defect characterization and failure analysis

Jinhong Liu,

Yaling Hua,

Junfu Liu

et al.

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Characterization and degradation of β-Sn particles in thermal aged Pb-rich solder joint for low-temperature co-fired ceramic (LTCC) applications

Liu,

Zhu,

Nie

et al. 2024

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Characterization and degradation of β-Sn particles in thermal aged Pb-rich solder joint for low-temperature co-fired ceramic (LTCC) applications

Liu,

Zhu,

Nie

et al. 2024

Rare Met.

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A novel insight into Au-Au thermosonic flip chip joint under extreme thermal cycles: Defect characterization and failure analysis

Cited by 1 publication

References 59 publications

Characterization and degradation of β-Sn particles in thermal aged Pb-rich solder joint for low-temperature co-fired ceramic (LTCC) applications

Characterization and degradation of β-Sn particles in thermal aged Pb-rich solder joint for low-temperature co-fired ceramic (LTCC) applications

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