2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and 2016
DOI: 10.1109/eurosime.2016.7463362
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A novel electrical-mechanical simulation flow to predict stress-induced circuit shifts

J.J.M. Zaal
1
,
J.H.J. Janssen
2
,
H.P. Tuinhout
3
et al.
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Cited by 2 publications
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References 11 publications
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Minimizing electro-mechanical shifts in IC applications

Zaal
1
,
Mavinkurve
2
,
Liang
3
et al. 2018
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
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Minimizing electro-mechanical shifts in IC applications

Zaal
1
,
Mavinkurve
2
,
Liang
3
et al. 2018
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
1
0
0
0
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Predictive thermo-mechanical models for the quantification of electro-mechanical interactions during production and field-life

Zaal
1
,
He
2
,
Claes
3
et al. 2023
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
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