A Novel Double-Sided Etching and Electroplating Fabrication Scheme for Coaxial Through-Silicon-Vias in 3-D Integration

Chen, Zhiming; Chen, Xuyan; Wang, Han; Cai, Ziru; Xiong, Miao; Hao, Yigang; Ding, Yingtao; Zhang, Ziyue

doi:10.1109/ted.2024.3438677

IEEE Trans. Electron Devices

2024

DOI: 10.1109/ted.2024.3438677

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A Novel Double-Sided Etching and Electroplating Fabrication Scheme for Coaxial Through-Silicon-Vias in 3-D Integration

Zhiming Chen,

Xuyan Chen,

Han Wang

et al.

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A Novel Double-Sided Etching and Electroplating Fabrication Scheme for Coaxial Through-Silicon-Vias in 3-D Integration

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References 30 publications

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