Abstract:Much like multi-storey buildings in densely packed metropolises, three-dimensional (3D) chip structures are envisioned as a viable solution to skyrocketing transistor densities and burgeoning die sizes in multi-core architectures. Partitioning a larger die into smaller segments and then stacking them in a 3D fashion can significantly reduce latency and energy consumption. Such benefits emanate from the notion that inter-wafer distances are negligible compared to intra-wafer distances. This attribute substantia… Show more
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