2022
DOI: 10.1109/tie.2021.3057026
|View full text |Cite
|
Sign up to set email alerts
|

A Novel Defect Detection Algorithm for Flexible Integrated Circuit Package Substrates

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
10
0

Year Published

2022
2022
2024
2024

Publication Types

Select...
9
1

Relationship

1
9

Authors

Journals

citations
Cited by 29 publications
(10 citation statements)
references
References 31 publications
0
10
0
Order By: Relevance
“…However, transitioning to computer vision in the traditional textile industry necessitates careful planning, strategic technology investment, and workforce training. Ensuring algorithm reliability in defect detection remains a significant research focus, addressing concerns about false positives and negatives (Zhong and Ma, 2021;Saberironaghi, Ren and El-Gindy, 2023).…”
Section: Literature Reviewmentioning
confidence: 99%
“…However, transitioning to computer vision in the traditional textile industry necessitates careful planning, strategic technology investment, and workforce training. Ensuring algorithm reliability in defect detection remains a significant research focus, addressing concerns about false positives and negatives (Zhong and Ma, 2021;Saberironaghi, Ren and El-Gindy, 2023).…”
Section: Literature Reviewmentioning
confidence: 99%
“…When the AOI result is out of the preliminarily set range, standard operation procedures (SOPs, such as re-work or scrap) can be conducted. AOI has became a mature technique and thus been widely used in various nonmicroelectronic industrial applications (e.g., packaging, drilling, and welding) [4][5][6]. In these applications, in practice, although production variations left negative impacts on the aesthetic appearance or information clarity, out-of-spec.…”
Section: Introductionmentioning
confidence: 99%
“…Currently, there is limited research on defect detection in the manufacturing processes of HDI substrates, particularly lacking effective detection methods for complex defect types such as etching defects. [7][8][9][10] High-density FICS digital images are acquired through a metallographic microscope platform, exhibiting diverse grain shapes, significant noise interference, and large variations in grayscale. 11,12 During defect detection, the texture structure of FICS images may resemble certain defects, thereby interfering with defect detection.…”
Section: Introductionmentioning
confidence: 99%